Heat dissipation control method, device and system, apparatus, and machine-readable medium

Abstract

The invention provides a heat dissipation control method, device and system, an apparatus, and a machine-readable medium. The method comprises: determining, by obtaining the temperature value of a target object as a current temperature value, whether the current temperature value reaches a preset temperature threshold value; if so, executing the motor drive, and opening a preset heat dissipation channel; operating a fan and instructing, by the fan, the air to enter an area where the target object is located from the heat dissipation channel, and / or instructing the air in the area where the target object is located to flows out of the heat dissipation channel, so that the temperature value of the target object is lower than the preset temperature threshold value; ff the humidity reaches a preset humidity threshold, executing the motor drive to close the opened preset heat dissipation channel to ensure the waterproof performance of a terminal device in a heat dissipation state. The heatradiation control method not only can discharge the heat of the terminal device, but also can ensure the waterproof performance of the terminal device during the heat radiation process.

Description

technical field [0001] The present invention relates to heat dissipation technology, in particular to a heat dissipation control method, device, system, equipment and machine-readable medium. Background technique [0002] With the increasing functions of current terminals (for example: face recognition terminals, mobile phones), their application scenarios are also becoming more and more diverse. When the device chip handles some special scenarios, the power consumption of the device chip will be greatly increased. If the power consumption is too high, a large amount of heat will be generated. If the heat generated cannot be dissipated in time, it will lead to thermal failure of the entire device, and problems such as image blur, poor touch screen, device crash, and internal chip circuit damage will indirectly cause customers The experience deteriorates and the brand image of the product is damaged. However, the heat dissipation efficiency of existing market equipment is l...

AI Technical Summary

Problems solved by technology

If the power consumption is too high, a large amount of heat will be generated. If the heat generated cannot be dissipated in time, it will cause the thermal failure of the entire device, and problems such as image blur, poor touch screen, device crash, and internal chip circuit damage will indirectly cause customers The experience deteriorates and the brand image of the product is damaged

However, the heat dissipation efficiency of existing market equipment is low, and the failure rate of equipment due to thermal failure increases, which cannot meet the efficient heat dissipation requirements of existing equipment in special occasions.

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