Bonding device and bonding method
A fixed mechanism and fixed platform technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc. The effect of improving efficiency and quality, small heat affected area and easy control
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[0038] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.
[0039] Such as Figures 1 to 3 As shown, the present invention provides a preferred embodiment of a bonding device based on a display panel.
[0040] A bonding device based on a product 20, the bonding device includes a laser 200, an indenter 310, a first buffer material fixing mechanism 400, a fixing platform and a pressing mechanism, and the fixing platform includes a fixing component 510 for fixing the product 20 , the material of the indenter 310 is a material with good light transmission and thermal conductivity; wherein, the pins of the product 20 are covered with a pre-pressed chip-on-chip film, and the pins of the product 20 are in contact with the An ACF is arranged between the COFs; and, the first buffer material fixing mechanism 400 clamps the buffer material 10 between the crimping surface of the pressure head 310 and the COF ...
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Abstract
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