Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for automatically detecting thickness of sapphire wafer

A sapphire wafer, automatic detection technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of low efficiency, unstable quality, and labor-intensive detection, so as to reduce the impact, avoid multiple detections, and save time Effect

Pending Publication Date: 2019-12-27
HANGZHOU ZHONGWEI PHOTOELECTRICITY
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a device for automatically detecting the thickness of a sapphire wafer for the problems of low efficiency and unstable quality caused by the need for a large amount of manpower to detect the thickness of the sapphire wafer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for automatically detecting thickness of sapphire wafer
  • Device for automatically detecting thickness of sapphire wafer
  • Device for automatically detecting thickness of sapphire wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 , figure 2 , image 3 A device for automatically detecting the thickness of a sapphire wafer is shown, including a support frame 1, an upper vision device 2, a detection device 3, a guide mounting plate 4, a lifting and conveying device 5, a lower vision device 6, and a marble detection platform 7. The upper visual device 2 , the detection device 3 , the guide mounting plate 4 , the lifting conveying device 5 , and the lower visual device 6 are all located inside the support frame 1 .

[0040] Such as image 3 As shown, the support frame 1 includes a first installation surface 11, a second installation surface 12, and a third installation surface 13 from top to bottom, and the first installation surface 11, the second installation surface 12, and the third installation surface 13 are connected to each other. Through, the first installation surface 11 is located on the top surface of the support frame 1 , the second installation surface 12 is located...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a device for automatically detecting the thickness of a sapphire wafer. The device comprises a support machine frame, an upper visual device, a detection device, a guide installation plate, a lifting conveying device, a lower visual device and a marble detection platform; the upper visual device and the lower visual device are used for finding the initial detection positionof the sapphire wafer and capable of reading and detecting the data index of the thickness of the sapphire wafer printed on a ceramic plate; the detection device is used for measuring the thickness of the sapphire wafer; the lifting conveying device can realize automatic horizontal transportation and vertical lifting transportation of the ceramic plate; the fact that the ceramic plate is automatically transported to a detection position is realized; the marble detection platform is used for placing the ceramic plate; and the detection stability and accuracy can be ensured. The device in the invention has the advantages of being high in detection efficiency, detection precision and automatic degree, simple in structure, convenient in assembly and maintenance and high in compatibility.

Description

technical field [0001] The invention relates to the vision measurement range of an automatic assembly line machine, in particular to an automatic detection device for detecting the thickness of a sapphire wafer. Background technique [0002] Sapphire (Sapphire, also known as white gem, molecular formula Al2O3) single crystal is an excellent multifunctional material. It has high temperature resistance, good thermal conductivity, high hardness, infrared transmission, and good chemical stability. Widely used in many fields of industry, national defense and scientific research, these fields have strict requirements on the thickness of the sapphire wafer used. [0003] The mainstream of current technical production is to manually use traditional methods to measure the thickness of sapphire wafers. Generally, digital display dial gauges are used as measurement tools, which is inefficient, has many single-point measurements, and has large errors. At the same time, it brings about ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06
CPCG01B11/06
Inventor 汪辉张飞康新领王亚伟谢可馨
Owner HANGZHOU ZHONGWEI PHOTOELECTRICITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com