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Protective agent for electronic component pin tin coating

A technology of electronic components and protective agents, applied in the direction of coatings, anti-corrosion coatings, etc., can solve the hidden dangers of product quality and reduce the reliability of electronic components, so as to improve reliability, prevent oxidation and discoloration, and improve corrosion resistance Effect

Active Publication Date: 2019-12-13
DONGGUAN TONGKE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the corrosion and oxidative discoloration of component pins reduces the reliability of electronic component products and brings serious quality hidden dangers to products

Method used

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  • Protective agent for electronic component pin tin coating
  • Protective agent for electronic component pin tin coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of protective agent of tin-plated layer of electronic component pin is inorganic-organic composite treatment liquid, wherein water-based acrylic resin is 150g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0023] The preparation of the protective agent for the tin-plated layer of the pins of the above-mentioned electronic components specifically includes the following steps:

[0024] (1), add 0.6L deionized water in the beaker;

[0025] (2), respectively take by weighing water-based acrylic resin 150g, silica sol 40g, zinc gluconate 10g, dimethylethanolamine 10g, benzotriazole 1.5g, add to step (1) under the condition of stirring Add water to the above beaker until the volume of the mixed solution is 1.0L to obtain the required protective agent A.

Embodiment 2

[0027] A kind of protective agent of tin-plated layer of electronic component pin is an inorganic-organic composite treatment solution, wherein water-based acrylic resin is 100g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0028] The preparation of the protective agent of above-mentioned a kind of electronic component pin tin-plated layer, just the water-based acrylic resin described in the step (2) is 100g, and other is with embodiment 1, finally obtains required protective agent B.

Embodiment 3

[0030] A kind of protective agent of tin-plated layer of electronic component pin is inorganic-organic composite treatment liquid, wherein water-based acrylic resin is 200g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0031] The preparation of the protective agent of above-mentioned a kind of electronic component pin tin-plated layer, just the water-based acrylic resin described in the step (2) is 200g, and other is with embodiment 1, finally obtains required protective agent C.

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PUM

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Abstract

The invention discloses a protective agent for an electronic component pin tin coating. The protective agent comprises 100-200 g / L of a water-based acrylic resin, 30-50 g / L of silica sol, 5-15 g / L ofzinc gluconate, 5-15 g / L of dimethylethanolamine and 1-2 g / L of benzotriazole. The protective agent can improve the corrosion resistance of the electronic component pin tin coating and prevent oxidation discoloring of the pin tin plating layer of the electronic component pin tin coating.

Description

technical field [0001] The invention belongs to the field of packaging of electronic components, and relates to a protective agent for tin-plated layers of pins of electronic components. Background technique [0002] In the tinning process of electronic component pins, due to the complexity of the tinning process, there will inevitably be a small amount of pores and cracks in the tin plating. At the same time, the lead tin plating generally adopts an acidic tin plating system, and the acidic plating solution has certain residues on the surface of the lead, especially in the defects such as pores and cracks [Xu Hao, Cause Analysis of Common Defects in Electroplating in Electronic Packaging, Electroplating and Finishing, 2008 (8): 21-23]. These factors reduce the corrosion resistance of component leads. In addition, during the long-term storage and processing of electronic components, the tin coating is exposed to the air, which will form oxides with the oxygen in the air, d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/04C09D5/08C09D7/61C09D7/63
CPCC08K2201/011C08L2203/20C09D5/08C09D133/04C09D7/61C09D7/63C08K3/36C08K5/098C08K5/17C08K5/3475C08K13/02
Inventor 郭晓明钟平权
Owner DONGGUAN TONGKE ELECTRONICS CO LTD
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