Multi-stage blind mating intelligent assembly device for high-density component and blind mating method thereof

Abstract

The invention discloses a multi-stage blind mating intelligent assembly device for a high-density component and a blind mating method thereof. The device comprises a three-dimensional servo motion platform, a precision optical platform, a TR component grabbing unit and a laser scanning unit, wherein the three-dimensional servo motion platform is arranged on the precision optical platform, the TR component grabbing unit and the laser scanning unit are both arranged on the three-dimensional servo motion platform, and the three-dimensional servo motion platform is used for controlling the motionof the TR component grabbing unit and the laser scanning unit in the three-dimensional space; an antenna structure is placed on the precision optical platform, and the TR component grabbing unit grabsTR components and realizes the blind mating of the antenna structure and the TR components under the positioning of the laser scanning unit and the movement of the three-dimensional servo motion platform. According to the multi-stage blind mating intelligent assembly device for the high-density component and the blind mating method thereof, the position and depth of a blind mating hole position of a connector can be automatically detected, in the blind mating assembly process of the blind mating connector, the blind mating hole position detection and positioning of different platforms and different array face scales are adapted, and references are provided for the blind mating assembly process.

Description

technical field [0001] The invention relates to the technical field of intelligent assembly, in particular to an intelligent assembly device and blind insertion method for multi-stage blind insertion of high-density components. Background technique [0002] In a radio frequency device, the transmission of radio frequency signals between each unit usually relies on radio frequency connectors, such as the transmission of radio frequency signals between the TR component and the antenna unit. Limited by the space and weight inside the RF device, most connectors are connected by blind-mating interconnection, that is, the electrical connection point is located in a closed cavity and is invisible. At present, the installation of blind-mating connectors basically relies on manual blind-mating. During the installation process, since the actual installation state of the connector cannot be observed and the pinhole of the RF connector is small (the diameter of the SMP connector is gen...

AI Technical Summary

Problems solved by technology

During the installation process, since the actual installation state of the connector cannot be observed and the pinhole of the RF connector is small (the diameter of the SMP connector is generally about 0.4mm), it is difficult for the operator to perceive the blind mating state of the blind mating connector, and the connector is prone to occur. If the needle is bent or even broken, the connector will be damaged and the radio frequency device will not work properly

In addition, under normal circumstances, the space of some radio frequency devices is limited, the arrangement density of internal components is high, and the installation and operation space of blind-mating connectors is narrow, which makes it difficult to install internal components and connectors, and the installation accuracy is difficult to guarantee, which affects the performance of the device

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