Electromagnetic shielding conductive foam and preparation method thereof

Abstract

The invention provides electromagnetic shielding conductive foam and a preparation method thereof. The electromagnetic shielding conductive foam comprises a conductive foam layer, a metal foil layer arranged below the conductive foam layer, and a rubber column assembly. Multiple positioning holes are uniformly formed in the conductive foam layer. The rubber column assembly comprises multiple rubber columns and a rubber connecting plate connected with one ends of the multiple rubber columns. The multiple rubber columns correspond to the multiple positioning holes in a one-to-one mode, and the rubber columns are arranged in the positioning holes. The rubber connecting plate is bonded to the upper end face of the conductive foam layer through glue. The conductive foam layer and the metal foillayer are bonded through conductive glue. When the electromagnetic shielding conductive foam is bent, the tensile stress generated by the metal foil layer generates a stress corresponding to the bending direction, and the conductive foam layer and the rubber columns in the conductive foam layer have good elastic restoring force and can counteract the generated stress, so that the shape, structure, conductive performance and shielding performance of the metal foil layer will not be influenced.

Description

technical field [0001] The invention relates to the field of foam, in particular to an electromagnetic shielding conductive foam and a preparation method thereof. Background technique [0002] The conductive foam layer usually combines metal foil and foam with conductive glue, and undergoes a series of treatments to make it have good surface conductivity and compressibility, making it suitable for small spaces and limited closing pressure. Electromagnetic shielding, widely used in electronic chassis, cabinets, indoor cabinets, industrial equipment, notebook computers, mobile communication equipment, etc. The conductive adhesive between the metal foil layer of the existing conductive foam layer and the foam is greatly affected by temperature. In an environment with poor heat dissipation at high temperature, the bonding viscosity is not enough, and it is prone to loosening and gaps, which affect its overall shielding effectiveness. Contents of the invention [0003] The ob...

AI Technical Summary

Problems solved by technology

The conductive adhesive between the metal foil layer of the existing conductive foam layer and the foam is greatly affected by temperature. In an environment with poor heat dissipation at high temperature, the bonding viscosity is not enough, and it is prone to loosening and gaps, which affect Its overall shielding effectiveness

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