A push-type integrated circuit board packaging mechanism

Abstract

The invention discloses a press type integrated circuit board packaging mechanism, and belongs to the technical field of integrated circuit board packaging. The press type integrated circuit board packaging mechanism comprises a packaging component and an insertion frame. The packaging component comprises a box body, a lifting plate, a pressure spring and a pressing frame. The box body is internally provided with an accommodating cavity. The lifting plate is slidably arranged in the accommodating cavity. The pressure spring is fixed on the lifting plate. The pressing frame penetrates through the box body to be connected with the lifting plate. A first through hole for insertion of the insertion frame is arranged on one side of the box body. The insertion frame is provided with an insertionplate. The insertion plate is movably inserted into the box body through the first through hole, and the insertion plate is located above the lifting plate and a clamping gap is formed between the insertion plate and the top of the accommodating cavity of the box body. The packaging pressure of the integrated circuit board is uniform and stable, the packaging fixation is stable and reliable, thestructural design is ingenious, the packaging device is simple and convenient to manufacture, the disassembly and assembly operation is flexible and convenient, the replacement of the integrated circuit board is convenient and the maintenance cost of the electronic product is reduced.

Description

technical field [0001] The invention relates to a mounting structure of a PCB integrated circuit board, in particular to a pressing type integrated circuit board packaging mechanism. Background technique [0002] In the process of technological development in recent years, integrated circuit technology has also made great progress. An integrated circuit board is a microelectronic structure that has circuit functions and relies on electric energy. When the integrated circuit board is installed, it needs to be packaged in the tube case to form a whole, and then it is installed in the electronic product. However, when the integrated circuit is damaged, the entire casing needs to be replaced, and the integrated circuit board cannot be replaced separately, thus making the maintenance cost of the electronic product relatively high. [0003] In view of the above problems, the Chinese patent application number CN201811374403.7, the application publication date is March 8, 2019, and...

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcomings of the existing integrated circuit board packaging device, such as complex structural design, high requirements for parts matching precision, and poor fixing stability of the integrated circuit board, and to provide a push-type integrated circuit board packaging mechanism, which adopts the present invention The technical solution uses a press-type packaging structure in the box to realize rapid positioning and installation of the integrated circuit board on the insertion frame through the pressing and rebound of the lifting plate, the packaging pressure of the integrated circuit board is uniform and stable, and the packaging is stable and reliable, and The structural design is ingenious, the packaging device is simple and convenient to manufacture, and the disassembly operation is flexible and convenient, which further facilitates the replacement of integrated circuit boards and reduces the maintenance cost of electronic products

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