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Cooling and dust removal device for computer mainframe

A technology of a dust removal device and a computer host, which is applied in the direction of combination device, electric digital data processing, digital processing power distribution, etc., can solve the problems of insufficient cooling effect, reduced computer service life, and inability to achieve complete dust removal, etc. Heat dissipation effect, dust reduction effect

Active Publication Date: 2020-09-15
HANGZHOU FUYANG FUXIANG COMP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] A large number of electrical components are arranged in the host computer of the computer, and these electrical components can dissipate a large amount of heat during work, if the heat is not discharged from the computer case in time, the performance and service life of the computer will be seriously affected. Therefore, in the prior art, the computer Cooling fans are all arranged in the case to cool down the computer. However, although the air entering the computer case can cool the computer, it also brings the dust in the air into the computer case, which reduces the service life of the computer. The dust removal and heat dissipation device of the computer mainframe simply uses a cooling fan to dissipate heat, and a dust collector is used for dust removal. This method cannot achieve thorough dust removal, and the cooling effect is not good enough. Therefore, there is an urgent need for a cooling and dust removal device for the computer mainframe. To solve the above problems, the present invention improves on the above shortcomings

Method used

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  • Cooling and dust removal device for computer mainframe
  • Cooling and dust removal device for computer mainframe
  • Cooling and dust removal device for computer mainframe

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Embodiment Construction

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, and the mode of the present invention includes but not limited to the following embodiments.

[0022] Such as Figure 1-5 As shown, a cooling and dedusting device for a computer mainframe of the device of the present invention comprises a computer case 11, a water tank 18 is fixedly arranged on the right side of the computer case 11, and a water storage cavity 54 is provided in the water tank 18, and the water storage The cavity 54 communicates with the computer case 11 through the water outlet pipe 30 and the water inlet pipe 12, the water outlet pipe 30 is fixedly provided with a water pump 29, the water circulation is realized by the water pump 29, and the computer case 11 is water-cooled to dissipate heat. A dust removal box 26 is fixedly arranged in the water storage chamber 54, and the dust removal box 26 is fixed in the water storage chamber 54 by a f...

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PUM

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Abstract

The invention discloses a cooling and dedusting device for a computer mainframe, comprising a computer case, a water tank is fixed on the right side of the computer case 11, and a water storage chamber is arranged in the water tank, and the water storage chamber and the computer case pass through The water outlet pipe and the water inlet pipe are connected, and a water pump is fixed on the water outlet pipe. The water circulation is realized through the water pump, and the computer case is water-cooled and radiated. For heat dissipation, the computer components are cooled by water cooling, and the computer components are dedusted and cooled by the gas circulating inside the device. For the gas after dust removal and cooling, the water cooling system cools the gas, which has a good heat dissipation effect. It also reduces the dust on the computer components.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a cooling and dust removal device for a computer host. Background technique [0002] A large number of electrical components are arranged in the host computer of the computer, and these electrical components can dissipate a large amount of heat during work, if the heat is not discharged from the computer case in time, the performance and service life of the computer will be seriously affected. Therefore, in the prior art, the computer Cooling fans are all arranged in the case to cool down the computer. However, although the air entering the computer case can cool the computer, it also brings the dust in the air into the computer case, which reduces the service life of the computer. The dust removal and heat dissipation device of the computer mainframe simply uses a cooling fan to dissipate heat, and a dust collector is used for dust removal. This method cannot achiev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20B01D50/00G06F1/18
CPCG06F1/20G06F1/183B01D50/60
Inventor 钱国臣
Owner HANGZHOU FUYANG FUXIANG COMP CO LTD
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