A planning method for in-situ measurement of high-steep complex surfaces
A technology with complex curved surfaces and high steepness, applied in the field of curved surface measurement, it can solve the problems of large longitudinal height difference and sparse measurement trajectories.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0058] The specific implementation manner of the present invention will be described in detail in conjunction with the technical scheme and the accompanying drawings.
[0059] In this embodiment, the high-steep complex curved surface S used is a free-form surface with concave-convex undulations, a height of 52.5 mm, a diameter of 100 mm, and four non-rotationally symmetrical pits in the circumferential direction. attached figure 1 It is a flow chart of the planning method of the present invention, and the specific steps of the in-situ measurement planning of the curved surface are as follows:
[0060] Step 1 Generate an initial scan path
[0061] First, calculate the maximum steepness angle α of the containing aspheric surface A of the high-steep complex surface S, and the maximum steepness angle α is the edge section circle l of the mouth of the containing aspheric surface A eq The unit normal vector at any point on with the unit reference vector The included angle, the...
PUM
![No PUM](https://static-eureka-patsnap-com.libproxy1.nus.edu.sg/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka-patsnap-com.libproxy1.nus.edu.sg/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com