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Touch screen disassembling platform

A touch screen and platform technology, applied in the direction of hand-held tools, manufacturing tools, etc., can solve the problems of increased disassembly difficulty, touch screen damage probability, poor temperature control, long working time, etc., to reduce manpower consumption, reduce disassembly difficulty and damage Probability, high degree of automation effect

Inactive Publication Date: 2019-11-12
福建汇思博数字科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this traditional touch screen disassembly process usually takes a long time, and the temperature is not easy to control. Moreover, during the period when the touch screen module is heated and placed on the disassembly platform for disassembly, the temperature of the touch screen module will continue to drop. The adhesive in the module slowly solidifies as the temperature drops, increasing the difficulty of disassembly and the chance of damage to the touch screen

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0067] Please refer to Figure 1 to Figure 6 , a touch screen removal platform, including a frame module and a heating separation module 5;

[0068] The frame module includes a frame panel 17 and a module carrier plate 33;

[0069] The module carrier 33 is arranged on the frame panel 17, and the module carrier 33 is used to place the touch screen module 30 to be disassembled;

[0070] The heating separation module 5 includes a top cylinder 1, a heating copper block 24, a heat-conducting silica gel block 28 and a high-temperature-resistant suction cup 26;

[0071] The top cylinder 1 is arranged above the module carrier plate 33, and the movable end of the top cylinder 1 is arranged toward the module carrier plate 33 and connected to the heating copper block 24, and the heating copper block 24 The bottom is provided with a heat-conducting silica gel block 28 hollowed out in the middle, and the bottom of the heating copper block 24 is provided with a high-temperature-resistant ...

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PUM

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Abstract

The invention provides a touch screen disassembling platform. The platform comprises a machine frame module and a heating separating module, wherein the machine frame module comprises a machine framepanel and a module carrier plate; the module carrier plate is arranged on the machine frame panel, and the module carrier plate is used for placing a touch screen module to be disassembled; the heating separating module comprises a top air cylinder, a heating copper block, a heat conduction silica gel block and a high-temperature-resistant sucker; the top air cylinder is arranged above the modulecarrier plate, the movable end of the top air cylinder is arranged in the direction of the module carrier plate and is connected with the heating copper block, the bottom of the heating copper block is provided with the heat conduction silica gel block with a hollow middle part, and the bottom of the heating copper block is provided with a high-temperature-resistant sucker. The heat conduction silica gel block is continuously heated by the heating copper block, the heat conduction silica gel block is in contact with the touch screen module to transmit temperature to the touch screen module, sothat the heat of the touch screen module in the disassembly process is kept constant, the situation that the disassembly is difficult due to the fact that an adhesive in the touch screen module is solidified in the disassembly process is avoided, the automation degree is high in the whole disassembly process, and the manpower consumption is reduced.

Description

technical field [0001] The invention relates to the field of disassembly equipment, in particular to a touch screen disassembly platform. Background technique [0002] The traditional touch screen disassembly process is to first heat the touch screen module through a heating platform to soften the adhesive in the touch screen module, and then place the heated touch screen module on a special disassembly platform for disassembly. Using this traditional touch screen disassembly process usually takes a long time, and the temperature is not easy to control. Moreover, during the period when the touch screen module is heated and placed on the disassembly platform for disassembly, the temperature of the touch screen module will continue to drop. The adhesive in the module slowly solidifies as the temperature drops, increasing the difficulty of disassembly and the chance of damage to the touch screen. Contents of the invention [0003] The technical problem to be solved by the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B27/00
CPCB25B27/00
Inventor 刘健
Owner 福建汇思博数字科技有限公司
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