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Grading grinding and polishing device based on composite gradient elastic small tool

A small tool, lapping and polishing technology, applied in the direction of manufacturing tools, abrasive surface adjustment devices, metal processing equipment, etc., can solve the problems of good processing effect, low processing efficiency and automation, material removal characteristics and unstable surface quality, etc. Achieve the effect of improving the processing effect, improving the processing efficiency and simplifying the residence time and the planning of the processing path

Pending Publication Date: 2019-11-08
ZHEJIANG UNIV OF TECH
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Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of material removal characteristics and unstable surface quality existing in the existing processing technology, as well as the relatively low processing efficiency and automation degree, and proposes a graded polishing device based on compound gradient elastic small tools, which has the advantages of High processing efficiency and automation, and good processing effect

Method used

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  • Grading grinding and polishing device based on composite gradient elastic small tool
  • Grading grinding and polishing device based on composite gradient elastic small tool
  • Grading grinding and polishing device based on composite gradient elastic small tool

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specific Embodiment

[0063] The present invention takes a specific embodiment as follows:

[0064] A graded lapping and polishing device based on a compound gradient elastic small tool, the compound gradient elastic small tool is composed of a rigid layer, a gradient layer and a homogeneous layer. The gradient layer is uniformly mixed with silicone rubber, softener, catalyst and other performance additives and then naturally cured. The preparation method is: weigh 470g of silicone rubber, 48g of softener, and 12g of performance additives. After mixing the above materials, Add the catalyst, mix evenly again, pour into the mold sequentially in the order of 1-3-5 rings and 2-4 rings, the depth of the mold groove is 5 mm, let it naturally ventilate, and obtain a gradient layer after curing for 6 hours; the homogeneous layer is formed by Silicon carbide, silicone rubber, softener, catalyst and other performance additives are evenly mixed, weigh 260g of silicone rubber, weigh 240g of silicon carbide wit...

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Abstract

The invention discloses a grading grinding and polishing device based on a composite gradient elastic small tool. The grading grinding and polishing device comprises a multi-degree-of-freedom mechanical arm, the grinding and polishing tool, a grinding and polishing tool finishing device and a swing arm contour graph, wherein the grinding and polishing tool comprises a grinding and polishing plate,an ultrasonic vibration auxiliary device and a driving device; the grinding and polishing plate is provided with a rigid layer, a gradient elastic layer and a homogenization layer from top to bottom,and a flow channel used for circulating a polishing solution is arranged in the center of the tool; and the grinding and polishing tool finishing device comprises a rotating plate driving motor and adiamond grinding plate, and the swing arm contour graph comprises a cross arm, a contour graph body and a cross arm support. The grading grinding and polishing device is simple in structure and highin automation degree, the grinding and polishing tool with different parameter combinations can be automatically replaced according to machining stages where workpieces are located, the grinding and polishing tool suitable for the workpieces can be selected according to different machining requirements of the different workpieces, rapid connection among the workpiece machining stages is realized,and the workpiece machining efficiency and the machining equipment utilization rate are fully improved while the machining effect of workpiece surfaces is improved.

Description

technical field [0001] The invention relates to the field of grinding and polishing processing of free-form surface optical elements, and more specifically relates to a graded polishing device based on compound gradient elastic small tools. Background technique [0002] With the rapid development of high-tech industries, hard and brittle materials such as sapphire, silicon wafers, and optical glass have been widely used in the optical and electronic industries because of their high hardness, high melting point, and high wear resistance. The surface shape accuracy and surface quality of such materials have a key influence on the quality and life of the device. [0003] At present, the processing methods for such hard and brittle materials mainly include stress disk, magneto-fluidic flow, ion beam, jet flow, etc. While making relevant technical breakthroughs, there are uneven material removal, poor processing efficiency and quality controllability, etc. The problem is that it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/00B24B53/14
CPCB24B27/00B24B27/0092B24B53/14
Inventor 金明生王礼明朱栋杰董晓星康杰
Owner ZHEJIANG UNIV OF TECH
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