Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Display substrate and preparation process of display substrate

A technology of display substrate and preparation process, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc. It can solve the problems that ink cannot be filled effectively, product quality is abnormal, and the edge of organic film cannot meet the design requirements, etc., so as to avoid product Exceptional quality effects

Active Publication Date: 2021-12-10
BOE TECH GRP CO LTD +1
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, limited by its own viscosity and fluidity, the ink cannot effectively fill some special-shaped areas (such as corners, especially areas with acute angles, such as figure 1 shown), so that the edge of the organic film cannot meet the design requirements, resulting in abnormal product quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display substrate and preparation process of display substrate
  • Display substrate and preparation process of display substrate
  • Display substrate and preparation process of display substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] Typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the description and drawings therein are illustrative in nature and not intended to limit the present disclosure. public.

[0051] In the following description of various exemplary embodiments of the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of example, various exemplary structures, systems, which may implement aspects of the present disclosure and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
Login to View More

Abstract

The disclosure proposes a display substrate and a manufacturing process of the display substrate. The display substrate includes a display area, a retaining wall surrounding the display area and a thin film encapsulation layer. The thin film encapsulation layer includes a first inorganic barrier layer, an organic barrier layer and a second inorganic barrier layer which are stacked. Wherein, the display area of ​​the substrate has corners. The base plate is provided with a plurality of convex dam structures at the positions corresponding to the corners. The part of the first inorganic barrier layer corresponding to the corner part covers a plurality of convex dam structures, and the part between two adjacent convex dam structures forms a diversion groove structure. Wherein, the organic barrier layer is formed of a fluid organic material, and the organic material is configured to be arranged on the corner portion of the first inorganic barrier layer under the capillary action of the diversion groove structure.

Description

technical field [0001] The present disclosure relates to the technical field of display devices, in particular to a display substrate and a preparation process of the display substrate. Background technique [0002] In the manufacturing process of existing display panels (such as OLED display panels), thin film encapsulation (TFE, Thin Film Encapsulation) is usually used for corresponding packaging to prevent water vapor or oxygen from invading the light-emitting layer, causing the light-emitting layer to fail, causing product defects or affecting Product reliability. Specifically, the thin-film encapsulation process is to generate a barrier layer that blocks water vapor and oxygen on the light-emitting layer of the OLED. The barrier layer usually adopts the design of "inorganic film-organic film-inorganic film". Among them, the inorganic film can prevent the intrusion of water vapor and oxygen, and the organic film can absorb stress and increase the bending performance of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCH10K50/8428H10K50/844H10K59/122H10K71/00H10K59/1201
Inventor 张杨扬李婧王大伟
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com