A Method for Intermittent Seal Failure Analysis of Sealed Circuit Modules in High Temperature Environment

Abstract

The invention discloses a method for analyzing intermittent sealing failure of a sealed circuit module in a high-temperature environment. The circuit module and rare gas are packaged into a cavity tooling, and the packaged cavity tooling is subjected to heating storage or power aging experiments. Carry out water vapor detection on the circuit module after the experiment to judge whether there is intermittent high-temperature sealing failure in the circuit module, conduct qualitative analysis on whether the sealed circuit module has internal and external gas exchange caused by poor sealing, and perform positioning analysis on unqualified circuit modules , cut the shell of the circuit module with high temperature intermittent seal failure into two parts, one part is heated and stored in the air atmosphere, and the other part is not processed, the pins and insulators on the circuit module shell are taken out, and the circuit module shell is Analyze the part that is in contact with the insulator on the upper part, find out the specific failure part with poor sealing, so as to analyze the specific cause of the failure part, and feedback the result to the manufacturer.

Description

technical field [0001] The invention belongs to the field of reliability detection of electronic components, and in particular relates to an analysis method for intermittent sealing failure of a sealed circuit module in a high-temperature environment. Background technique [0002] Various materials are used in the manufacturing process of electronic components and the assembly process is complex, which brings great challenges to the atmosphere control inside microelectronic products. During the manufacturing process of the sealed circuit module, moisture may be introduced into the substrate, filled inert gas, chip, adhesive material, soldering material, packaging process, etc. Excessive water vapor content will cause the circuit to suffer from chip electrical performance degradation, metal migration, and material corrosion failure. In addition, some failure causes are also closely related to the abnormal content of other atmospheres inside the circuit. For example, the shea...

AI Technical Summary

Problems solved by technology

At present, there is a problem among microelectronic devices: when analyzing the internal water vapor content, it is found that some microelectronic devices that have passed the sealing test contain a large amount of water vapor, oxygen, etc.

This shows that although the microelectronic device has passed the sealing leak test, there is actually a problem of poor sealing.

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