LED chip and manufacturing method thereof
A technology of LED chips and electrodes, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of no light-emitting area and light loss in the N-type electrode area, improve luminous efficiency and luminous brightness, avoid leakage, and improve current expansion effect of effect
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[0045] In order to make the content of the present invention clearer, the content of the present invention will be further described below in conjunction with the accompanying drawings. The invention is not limited to this specific example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0046] The LED chip provided by this embodiment, such as Figure 3-Figure 5 shown, including:
[0047] substrate1;
[0048] The epitaxial layer structure arranged on the surface of the substrate 1; the epitaxial layer structure includes: N-type semiconductor layer 2, active region 3, P-type semiconductor layer 4, highly doped P-type semiconductor layer 5, high Doped tunneling layer 6;
[0049] The surface of the epitaxial layer structure away from the substrate includes an N electrode fabrication area and a P electrode fabricat...
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