Conductive paste specially used for glass-based circuit board

Abstract

The present invention provides a conductive paste specially used for a glass-based circuit board. The conductive paste consists of special conductive materials, organic bonding agents and inorganic additives. Based on 100 parts, by mass, of the conductive paste specially used for the glass-based circuit board, the conductive paste comprises 78-87 parts of the special conductive materials, 9-10 parts of the organic bonding agents and 3-13 parts of the inorganic additives, wherein the inorganic additives are glass powders. According to the conductive paste, the mass proportion, in the conductivepaste, of the special conductive materials is improved, and thus the electrical conductivity of circuits is enhanced; the organic bonding agents and the inorganic additives with good performances areselected, and the right proportion is chosen, so that the paste has the advantages of moderate viscosity, good fluidity and strong adhesive force, the contact among particles of the special conductive materials is closer, a continuous and compact silver film is easy to be formed when the circuit board is printed, and the resistivity is low; and the special conductive materials are selected, and the special conductive materials have the advantages of good compactness and good flexibility.

Description

technical field [0001] The invention relates to a special conductive paste for a glass-based circuit board, which belongs to the technical field of electronic materials. Background technique [0002] Conductive paste is generally composed of conductive metal powder, binder, solvent and other auxiliary agents, and is printed on the paste carrier by a certain printing method, and solidified under a certain temperature and time to form a conductive circuit. The content of the metal conductive material in the paste will directly affect the electrical conductivity of the circuit. Studies have shown that when the content of the conductive material in the conductive paste is 80% to 90% by weight, the electrical conductivity is the best. At present, the proportion of conductive materials in the conductive paste for making glass-based circuit boards is less than 75%. It has sufficient cohesive force and will not cause the conductive particles to fall off, so it is difficult to incre...

AI Technical Summary

Problems solved by technology

At present, the proportion of conductive materials in the conductive paste for making glass-based circuit boards is less than 75%. It has sufficient adhesive force to prevent the conductive particles from falling off, so it is difficult to increase the content of conductive materials in the existing paste

However, the mass ratio of the traditional conductive paste has not reached the optimal ratio of the conductive material content in the paste, and there is still room for improvement in the conductivity, and the use of a large number of additives greatly increases the brittleness of the conductive line, and deformation occurs on the glass substrate. It is easy to break and cause damage to the glass-based circuit board