Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surge protection device MOV chip and preparation method thereof

A surge protector and chip technology, which is applied in the manufacture of resistor chips, overvoltage protection resistors, resistors, etc., can solve problems such as cost increase, lightning strike protection, and residual voltage increase, so as to reduce product waste and solve The effect of the fire problem

Pending Publication Date: 2019-08-30
谭乔文
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 4. The protection of method 3 cannot ensure that the SPD will not catch fire or be struck by multi-pulse overvoltage lightning, and will lead to an increase in cost;
[0006] 5. The protection of method 2 uses a backup protector. When the backup protector is disconnected, the protected object cannot be protected from lightning strikes, and using a backup protector will lead to an increase in residual voltage, which is not conducive to protection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surge protection device MOV chip and preparation method thereof
  • Surge protection device MOV chip and preparation method thereof
  • Surge protection device MOV chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Such as Figure 1 to Figure 8 As shown, a surge protector MOV chip, the outer side of the MOV chip is insulated and composed of a plurality of unit MOV chips 1 connected in series, electrodes 4 and electrodes 5 are fixed at both ends of the MOV chip and a graphene layer is arranged, and the unit MOV Graphene layers 3 are arranged on both sides of the chip 1;

[0045] The preparation method of surge protector MOV chip comprises the following steps:

[0046] 1.1 First, the ingredients are pressed into a unit MOV chip with a voltage equivalent that can break down but is not enough to burn (it can be square or round) (see figure 1 ), you can also first press the ingredients into a cylinder (or cuboid) and then cut according to a voltage equivalent that the unit MOV chip can break down but is not enough to burn (see figure 1 );

[0047] 1.2 Then in unit MOV chip 1 (see figure 1 ) spray (paint) (print) (cover) (paste) graphene layer 2 on both surfaces (see figure 2 ); ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a surge protection device MOV chip. The outer side of the MOV chip is insulated and is formed by connecting a plurality of unit MOV chips in series. Electrodes are fixed at the two ends of the MOV chip and the MOV chip is provided with graphene layers, and the surfaces of the two sides of each unit MOV chip are provided with the graphene layers. The unit MOV chips of the MOV chip unit can be broken down but is not enough to combust at an equivalent weight. Graphene layers are arranged on the two surfaces of the MOV chip. The whole MOV chip is formed by pressing and sintering a unit MOV chip combination with graphene arranged on the two surfaces, so the whole MOV chip is prevented from being punctured after the unit MOVs are punctured, and the problem that the lightning stroke multi-pulse surge protection device cannot be protected is solved. The problem of fire breakout of the MOV chip is also solved. The surge protection device using the MOV chip does not needto be provided with a backup protection device, so that the product waste is reduced.

Description

technical field [0001] The invention relates to the technical field of surge protector MOV chips, in particular to a surge protector MOV chip and a preparation method thereof. Background technique [0002] 1. The MOV chip of the surge protector is prone to breakdown and fire after being struck by power frequency current or multi-pulse lightning, causing fire hazards. There is a discussion on whether to install surge protectors in the low-voltage electrical appliance committee; [0003] 2. The SC37A surge protector team is discussing using a surge protector backup protection device to protect the surge protector to prevent the surge protector from igniting; [0004] 3. The SC37A surge protector group is discussing intelligent surge protectors to prevent surge protectors from catching fire; [0005] 4. The protection of method 3 cannot ensure that the SPD will not catch fire or be struck by multi-pulse overvoltage lightning, and will lead to an increase in cost; [0006] 5. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01C7/12H01C7/00H01C17/00
CPCH01C7/126H01C7/001H01C17/006
Inventor 谭乔文
Owner 谭乔文
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com