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Copper particle with surface subjected to antioxidant protection, low-temperature sintered copper paste and sintering process using low-temperature sintered copper paste

A technology of low-temperature sintering and copper particles, which can be used in metal processing equipment, electrical components, circuits, etc., and can solve problems such as low surface energy and insoluble problems that plague the semiconductor packaging industry

Active Publication Date: 2019-08-30
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the relatively high sintering temperature of sintered copper still plagues the semiconductor packaging industry
Compared with silver, although copper has a higher surface energy, it is easier to oxidize, so that insoluble and lower surface energy oxides are formed on the surface

Method used

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  • Copper particle with surface subjected to antioxidant protection, low-temperature sintered copper paste and sintering process using low-temperature sintered copper paste
  • Copper particle with surface subjected to antioxidant protection, low-temperature sintered copper paste and sintering process using low-temperature sintered copper paste
  • Copper particle with surface subjected to antioxidant protection, low-temperature sintered copper paste and sintering process using low-temperature sintered copper paste

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 10 g of copper particles with an average particle diameter of 0.1 μm were selected, and the configuration of the film-forming solution was: 0.75 g of BTA; 0.03 g of DPPD; and 500 ml of water. After film formation, it was confirmed by TEM that a uniform OSP film was formed on the surface of the copper particles with a film thickness of about 5 nm, and it was confirmed by XPS that the DPPD content in the OSP film was about 3.5% by mass.

Embodiment 2

[0045] 12 g of copper particles with an average particle diameter of 1 μm were selected, and the configuration of the film-forming solution was: 1.25 g of IM; 0.12 g of DPPD; and 500 ml of water. After film formation, it was confirmed by TEM that a uniform OSP film was formed on the surface of the copper particles with a film thickness of about 60 nm, and it was confirmed by XPS that the DPPD content in the OSP film was about 7.6% by mass.

Embodiment 3

[0047] 10 g of copper particles with an average particle diameter of 8 μm were selected, and the configuration of the film-forming solution was: 1 g of BIM; 0.05 g of DPPD; and 500 ml of water. After film formation, it was confirmed by TEM that a uniform OSP film was formed on the surface of the copper particles with a film thickness of about 50 nm, and it was confirmed by XPS that the DPPD content in the OSP film was about 4.4% by mass.

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Abstract

The invention relates to a copper particle with a surface subjected to antioxidant protection, a low-temperature sintered copper paste, and a sintering process using the low-temperature sintered copper paste. According to the copper particle with the surface subjected to antioxidant protection, the surface of the copper particle is modified by an organic solderable protective agent, wherein the organic solderable protective agent contains a certain proportion of diphenyl-p-phenylenediamine. The organic solderable protective agent may be at least one of benzotriazole, imidazole, and benzimidazole.

Description

technical field [0001] The invention relates to a copper particle with anti-oxidation protection on the surface, a low-temperature sintered copper paste and a sintering process using the same, which are especially used in the field of semiconductor packaging materials. Background technique [0002] A new generation of power modules for electric vehicles, aviation, and other industries requires high power and high service temperature. It has been demonstrated in the past 10 years that wide bandgap semiconductors can withstand high operating temperatures above 300°C. However, traditional packaging materials, such as tin-based solders and conductive adhesives, are limited to operation below 200°C. Researchers have been looking for ways to achieve high reliability at high temperature and high power. In past explorations, sintering of silver or copper was found to be a promising approach. For cost considerations, copper sintering is a technology that has been tried in recent y...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F3/10H01L23/488H01L21/60
CPCB22F3/1007H01L24/29H01L24/27H01L24/83H01L2224/29147H01L2224/83024H01L2224/8384B22F1/102
Inventor 张卫红刘旭敖日格力叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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