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Adhesive dispensing device

A dispensing device and dispensing technology, which is applied to the device and coating of the surface coating liquid, which can solve the problems of uneven dispensing effect and colloid escape.

Active Publication Date: 2019-08-27
广东迈特盛科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned technical problems, the present invention provides a dispensing device to solve the problems of uneven dispensing effect and colloid escape in the existing dispensing methods Problem, the dispensing device can effectively improve the dispensing effect and ensure the stability of dispensing

Method used

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Embodiment Construction

[0014] The invention discloses a glue dispensing device, which can effectively improve the glue dispensing effect and ensure the glue dispensing stability.

[0015] The technical solution in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, what is described is only a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0016] see figure 1 and figure 2 As shown, the present invention provides a dispensing device, including a position fine-tuning device, a support frame 3, a heating cylinder 17, a dispensing cylinder 13, a lifting block 12, a driving mechanism 1 and a pressurized air pipe 9, and the position fine-tuning device is connected to The su...

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Abstract

The invention provides an adhesive dispensing device. The adhesive dispensing device comprises a position fine adjustment device, a support frame, a heating cylinder, an adhesive dispensing cylinder,a lifting block, a drive mechanism and a pressurization air pipe, wherein the position fine adjustment device is connected with the support frame, the heating cylinder is detachably arranged on the lower portion of the support frame, a stop block is arranged at the top of the support frame, the pressurization air pipe penetrates through the stop block, one side, facing the heating cylinder, of thesupport frame, is provided with a guide rail along the vertical direction, the lifting block is arranged on the guide rail and can slide up and down, a through hole is formed in the heating cylinder,the adhesive dispensing cylinder is arranged in the through hole in up and down sliding mode, the upper end and the lower end of the adhesive dispensing cylinder are exposed out of the through hole,an opening is formed in the top of the adhesive dispensing cylinder, an adhesive outlet pipe is arranged at the bottom of the adhesive dispensing cylinder, and a first dummy plate and a first siliconepart are arranged in the adhesive outlet pipe. The adhesive dispensing device aims at solving the problems that an existing adhesive dispensing mode is uneven in adhesive dispensing and enables adhesive to overflow.

Description

technical field [0001] The invention belongs to the field of dispensing tools, in particular to a dispensing device. Background technique [0002] In the production of various electronic components, such as in the production process of coils, it is often necessary to package the coils with insulating plastic shells, so as to avoid interference between external power equipment and coils, and the external plastic shells need to pass through the point The form of glue is used to realize the combination of different shell parts and the mutual fixation between the coil and the shell, so dispensing is a necessary process in the production of various electronic components. The existing dispensing method is basically by setting the manipulator clamp Dispensing electronic products with a rubber cartridge. However, the existing dispensing method uses mechanical extrusion to squeeze the glue out of the rubber cartridge. This mechanical extrusion method is difficult to control the glue ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/0241B05C11/1042B05C11/1013
Inventor 邵炳志
Owner 广东迈特盛科技有限公司
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