Microstrip coupler and PCB (printed circuit board)

Abstract

The invention provides a microstrip coupler and a PCB. The microstrip coupler comprises a wire laying layer and an etching layer laminated correspondingly, the wire laying layer is used to lay microstrip wires and forms an interdigital part, the etching layer is used to etch a defect area, the defect area is partially overlapped with the interdigital part, the defect area changes electric field and magnetic field distribution of the etching layer as well as the distribution inductance and capacitance of the microstrip wires laid on the wire laying layer laminated corresponding to the etching layer, so that the microstrip wires have band cap and slow wave characteristics, further the coupling intensity of the microstrip wires in the unit distance is increased, basis is provided for increasing the distance between the microstrip wires, and the production cost of the microstrip coupler is reduced under the condition that the coupling performance of the microstrip coupler is ensured.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to a microstrip coupler and a PCB circuit board. Background technique [0002] Couplers are commonly used devices in communication equipment and are mainly used for signal sampling. The integrated chip coupler is commonly used in traditional communication equipment. Since the chip coupler can no longer meet the miniaturization design requirements in the multilayer PCB circuit board design, the microstrip coupler came into being. [0003] While the microstrip coupler meets the requirements of miniaturization design, it is also necessary to consider whether the RF performance index and PCB processing accuracy also meet the actual use and production requirements. In the prior art, in order to realize the strong coupling of the microstrip traces of the microstrip coupler, the distance between the microstrip traces of the microstrip coupler needs to be reduced, but the existing PCB ...

AI Technical Summary

Problems solved by technology

In the prior art, in order to realize the strong coupling of the microstrip lines of the microstrip coupler, the distance between the microstrip lines of the microstrip line coupler needs to be reduced, but the existing PCB circuit board production scheme cannot meet this requirement. The demand makes the production of microstrip couplers need to be realized with the help of other more advanced PCB circuit board production schemes, which increases the production cost of microstrip couplers

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