TP type microwave composite medium copper-clad substrate

Abstract

The invention relates to the technical field of microwave composite medium copper-clad substrates and discloses a TP type microwave composite medium copper-clad substrate. The TP type microwave composite medium copper-clad substrate comprises a hot-pressing tank and is characterized in that a connecting block is arranged on the surface of the hot-pressing tank, the right side of the connecting block is movably connected with the right side of the inner wall of the hot-pressing tank, a hydraulic rod is arranged on the surface of the connecting block, and the top end of the hydraulic rod is fixedly connected with the lower surface of the connecting block. The TP type microwave composite medium copper-clad substrate has the advantages that by the coordination of a forming groove, a heat conduction plate and a heating plate, a stirred medium falls into the forming groove, the heat conduction plate transmits the residual heat of a stirring tank, the medium is heated through the heating plate, hot pressing of the medium stirred by the stirring tank can be completed, the stirred medium layer can still keep the heat during conveying after being heated, and the problem that the heated medium naturally cools when an existing microwave composite medium copper-clad substrate is used to perform hot pressing.

Description

technical field [0001] The invention relates to the technical field of TP-type microwave composite dielectric copper-clad substrates, in particular to a TP-type microwave composite dielectric copper-clad substrate. Background technique [0002] The existing TP-type microwave composite dielectric copper-clad substrate is generally produced by ball-milling the dielectric material, then batching, hot-pressing, cold-pressing, and then copper-clad, and finally completes the entire production process. When the raw materials are hot-pressed, the chassis is running, and the chassis will vibrate at this time, which will affect the internal dielectric material to a certain extent, which will cause problems in the final formed product of the dielectric material. This situation not only affects the microwave composite dielectric coating. The quality of the finished copper foil substrate also increases the problem of manual additional reprocessing in the later stage. Therefore, we propos...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a TP-type microwave composite dielectric copper-clad substrate, which has the advantages of buffering vibration and high efficiency, and solves the problems caused by the existing microwave composite dielectric copper-clad substrate during production. Vibration affects the quality of the final product

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