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Method for improving the wetting of surface of solid substrate by liquid metal

A liquid metal, solid substrate technology, applied in metal material coating process, chemical/physical/physicochemical process of energy application, coating, etc., can solve unsatisfactory problems, etc.

Active Publication Date: 2019-07-23
CONSTELLIUM ISSOIRE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The object method of this patent is operable for wires with a diameter close to 0.5 cm, but is unsatisfactory to operate on wires with smaller diameters (eg 0.2 mm) because it is too slow

Method used

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  • Method for improving the wetting of surface of solid substrate by liquid metal
  • Method for improving the wetting of surface of solid substrate by liquid metal
  • Method for improving the wetting of surface of solid substrate by liquid metal

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Embodiment Construction

[0035] The use of ultrasound is sought in different industrial applications: at high power, ultrasound can eg be used in cleaning applications. At low power, they are often used for non-destructive inspection applications in materials or structures.

[0036] The present invention is based on the advantageous application of power ultrasound to increase the wetting of the surface of a solid substrate by liquid metal. In fact, the inventors have found that the application of high power ultrasound to a metal or ceramic substrate immersed in a molten pool formed by liquid metal results in increased wetting of the substrate surface by the liquid metal.

[0037] According to a first application, the invention is used to deposit a metal layer on a substrate. The first embodiment is in Figure 1A shown in . A solid substrate 21 formed of a first material, such as aluminum alloy or ceramic, is immersed into a molten pool of a second metal 22 in liquid state. In this embodiment, the l...

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Abstract

The invention relates to a method for treating a solid substrate, performed with a first material, of the metal or ceramic type, the method comprising bringing the substrate into contact with a liquidmetal, while the substrate is exposed to an ultrasound wave called a power ultrasound wave. On a surface of the substrate, the power flux density is higher than a cavitation threshold of the liquid metal. Such an exposition improves the wettability of the surface of the substrate by the liquid metal.

Description

technical field [0001] The technical field of the invention is the modification of the wetting of material surfaces relative to liquid metals under the effect of exposure to high power ultrasound. Background technique [0002] In some applications, it is desirable to form a layer of metal on the substrate, ie, cap metal. This is the case, for example, of aluminum wires intended to be used as electrical conductors. The light weight of these aluminum wires makes them especially suitable for use in automobiles or aviation. Due to the formation of an insulating oxide layer on the surface, aluminum wire has a high surface resistance, which is detrimental to obtaining a high-quality electrical connection. A protective layer formed by a nickel layer is described in patent FR2796656 when the cross-section of the aluminum wire is large. The object method of this patent is operable for wires with a diameter close to 0.5 cm, but operation on wires with smaller diameters (eg 0.2 mm) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J19/10
CPCB01J19/10B01J2219/0879C04B41/4525C04B41/515C04B41/5155C04B41/5161C04B41/5166C04B41/88C23C2/32
Inventor J-L·阿沙尔F·塔伊纳
Owner CONSTELLIUM ISSOIRE
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