Packaging structure and packaging method of image sensor

Abstract

The invention discloses a packaging structure and a packaging method of an image sensor, and relates to the field of semiconductor packaging. The packaging structure comprises a substrate and the image sensor, wherein the image sensor is fixedly arranged on the first surface of the substrate; a transparent cover plate is adhered above the image sensor through a supporting side wall; the image sensor is electrically connected with the first surface of the substrate, and a side plate is arranged at the boundary of the substrate; and filling glue is distributed in an area surrounded by the side plate, the image sensor, the substrate, the transparent cover plate and the electric connection position. According to the image sensor packaging structure and the packaging method provided by the invention, the packaged image sensor has relatively high structural strength, and he distribution amount can be conveniently controlled when the filling glue is dispensed, so that the influence of overflow of the filling glue on the sensing performance is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging structure and a packaging method of an image sensor. Background technique [0002] Image sensor is the core device of digital image equipment, which can convert optical image signal into electronic signal for processing. Generally, in order to protect the chip of the image sensor, make it work stably for a long time and maintain good sensing sensitivity for a long time, it is necessary to design a stable and reliable packaging structure. When packaging the image sensor, on the one hand, it is necessary to protect the photosensitive area of ​​the sensing chip; processing impact. [0003] In the prior art, when packaging image sensors, multiple processing steps are generally designed and complex processing techniques are used, which not only requires a large cost investment, but also makes it difficult to ensure the yield of the packaged product after the cost i...

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Problems solved by technology

[0003] In the prior art, when packaging image sensors, multiple processing steps are generally designed and complex processing techniques are used, which not only requires a large cost investment, but also makes it difficult to ensure the yield of the packaged product after the cost is invested. For example, in the packaging process In the process, it often occurs that the colloid overflows into the sensing signal receiving range of the image sensor due to too much filling colloid, resulting in a decrease in sensing performance, which greatly reduces the yield rate of the packaged product and has a great impact on the economic benefits of the enterprise.

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