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Electrolytic nickel (alloy) plating solution

一种电解镀覆、镍合金的技术，应用在电路、印刷电路、电气元件等方向，能够解决构造体不良、填充性不足、无法抑制孔隙的产生等问题，达到增加镍析出量、牢固接合的效果

Active Publication Date: 2022-01-11
JAPAN PURE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, according to the further experiments of the present inventors (the examples described later), it can be known that the fillability of the electrolytic nickel plating solution described in Non-Patent Document 2 is still insufficient, and the generation of pores cannot be suppressed, and the formation of voids in the precipitates is still insufficient. Cracks, it can be seen that it is still bad as a structure
[0012] The miniaturization of electronic parts is progressing day by day. In this known technology, the fillability of tiny holes or tiny recesses is insufficient. It is expected to develop a nickel filling method that does not cause defects such as pores or cracks.

Method used

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  • Electrolytic nickel (alloy) plating solution
  • Electrolytic nickel (alloy) plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 6、 comparative example 1 to 3

[0163] As a model of the minute concave portion, a 12 mm square evaluation printed circuit board (manufactured by Japan Circuit Co., Ltd.) having a laser guide hole with an aspect ratio of 0.88 (φ45 μm×40 μmD) was used.

[0164] The cross-sectional view of the periphery 10 of the plated part is as figure 1 shown. After attaching copper foil 13 with a thickness of 12 μm to the via hole forming portion of a substrate 11 made of BT (Bismaleimide-Triazine) with a thickness of 0.4 mm, a prepreg type build-up resin 12 with a thickness of 60 μm is laminated, and then laser Make a blind hole (hereinafter sometimes referred to as "conducting hole" or "guide hole") 14 with a diameter of 45 μm and a depth of 40 μm, and through electroless copper plating, on the outer surface of the substrate (the surface of the build-up resin 12 ) and the guide hole 14 A seed layer 15 of about 1 μm is formed on the inner wall surface of the .

[0165] Then it is formed by a dry film photoresist (DFR: D...

Embodiment 7 to 8、 comparative example 4

[0192] A copper wire (φ0.9mm) and a copper plate (20mm×20mm×0.3mmt) with a masked back surface were used as a model of the electronic component to be joined.

[0193] Such as image 3 As shown, prepare two copper plates 22 after shielding the back side by the masking material 22a, clamp the copper wire 21 with the unshielded surface of the two copper plates 22, and fix it with the auxiliary tool 23, and make the copper wire 21 and An electronic component sample 20 in which a minute gap 24 is formed between copper plates 22 .

[0194]

[0195] An electrolytic nickel plating solution was prepared by dissolving in deionized water so as to be 600 g / L of nickel sulfamate, 10 g / L of nickel chloride, and 30 g / L of boric acid, respectively.

[0196] The additives shown in Table 4 were added to the above-mentioned electrolytic nickel plating solution so as to be added in the amounts shown in Table 4, and dissolved.

[0197] Then, an appropriate amount of 100 g / L aqueous sulfamic ac...

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Abstract

The subject of the present invention is to provide a kind of electrolytic nickel (alloy) plating liquid, when filling the tiny holes or tiny recesses (14) in the electronic circuit parts by nickel or nickel alloy (18), can not produce pores Filling under defects such as cracks or cracks, and when bonding two or more electronic parts, the electronic parts can be firmly joined to each other by filling the small gaps. In addition, the subject is to provide a nickel or nickel alloy plating filling method using the electrolytic nickel (alloy) plating solution, a method of manufacturing a micro three-dimensional structure, an electronic component assembly, and a method of manufacturing the same. The above-mentioned problems can be solved by using an electrolytic nickel (alloy) plating solution containing a specific N-substituted pyridinium compound to fill microscopic pores or microscopic recesses (14).

Description

technical field [0001] The present invention relates to an electrolytic nickel plating solution or an electrolytic nickel alloy plating solution (hereinafter sometimes collectively referred to as "electrolytic nickel (alloy) plating solution". In addition, sometimes by using electrolytic nickel (alloy) plating solution precipitated "Nickel or nickel alloy" is referred to as "nickel (alloy)"). More specifically, it relates to plating and filling of tiny holes or tiny recesses in electronic parts, and when two or more electronic parts are stacked on top of each other. The electrolytic nickel (alloy) plating solution is filled in the plating of the generated minute gap. [0002] Furthermore, the present invention relates to a method of plating and filling microscopic holes or microscopic recesses using the electrolytic nickel (alloy) plating solution, a method of manufacturing a micro three-dimensional structure, an electronic component assembly, or the manufacturing method there...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D7/00
CPCC25D7/00C25D3/18C25D5/02C25D7/123C25D7/12C25D3/562H05K3/423H01L21/2885C25D3/12
Inventor 柴田和也大平原祐树
Owner JAPAN PURE CHEM
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