Proximity exposure method and device

An exposure method and a proximity technology, applied in the exposure field, can solve problems such as poor exposure accuracy and inability to apply high-precision product production requirements, and achieve the effect of improving alignment accuracy

Active Publication Date: 2019-06-25
CHENGDU ZHONGDIAN PANDA DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, the exposure accuracy of the existing proximity exposure method is poor, above ±1.5um, which cannot be applied to the production requirements of high-precision products, such as the array process of the TFT industry

Method used

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  • Proximity exposure method and device
  • Proximity exposure method and device

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049]figure 1 Schematic structure of the proximity exposure system provided for the embodiment of the present invention Figure 1 . The proximity exposure system includes: a light source, a mask 11 , a substrate 12 , a first machine 13 , a second machine 14 , a CCD camera 15 , and a control terminal 16 . The light source is used to emit a light...

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Abstract

The embodiment of the invention provides a proximity exposure method and device. The method includes the following steps: acquiring the position deviation between the projection of a first alignment mark of a current mask on a substrate and a second alignment mark on the substrate, wherein the position deviation includes transverse offset, longitudinal offset and rotation angle offset; and adjusting the positions of the mask and the substrate according to the current position deviation, and executing the step of acquiring the position deviation between the projection of the first alignment mark of the current mask on the substrate and the second alignment mark on the substrate again until the projection of the first alignment mark on the substrate is consistent with the second alignment mark on the substrate in position. The position deviation acquired in the embodiment of the invention is closer to the actual deviation value between the mask and the substrate. Real-time alignment canbe realized, and the alignment accuracy can be improved.

Description

technical field [0001] The embodiments of the present invention relate to the field of exposure technology, and in particular to a proximity exposure method and equipment. Background technique [0002] Proximity exposure means that the workpiece coated with the photosensitive agent is approached to the mask with a gap of several 11 μm to several 110 μm relative to the mask, and the exposure light is irradiated on the workpiece through the mask to perform exposure. [0003] In the prior art, the proximity exposure method is to measure the position of the Mark on the mask before each exposure and then perform exposure, and adjust the exposure position by moving the mask and the glass substrate. [0004] However, the exposure accuracy of the existing proximity exposure method is poor, above ±1.5um, and cannot be applied to the production requirements of high-precision products, such as the array process of the TFT industry. Contents of the invention [0005] Embodiments of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 陈超胡仁卜王凌峰钟元杰刘良军
Owner CHENGDU ZHONGDIAN PANDA DISPLAY TECH CO LTD
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