An Artificial Surface Plasmon Transmission Line Based on Delta Stubs Structure

A plasma and artificial surface technology, applied in the direction of electrical components, waveguides, circuits, etc., can solve the problems of limited groove depth, increased SSP-TL size, weak electromagnetic field control ability, etc., to reduce length, realize miniaturization, reduce The effect of small size structures

Active Publication Date: 2022-01-07
NANJING UNIV OF POSTS & TELECOMM
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, but it is bound to increase the size of the SSP-TL

Method used

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  • An Artificial Surface Plasmon Transmission Line Based on Delta Stubs Structure
  • An Artificial Surface Plasmon Transmission Line Based on Delta Stubs Structure
  • An Artificial Surface Plasmon Transmission Line Based on Delta Stubs Structure

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Embodiment

[0015] Example: such as figure 1 As shown, an artificial surface plasmon transmission line based on the Delta Stubs structure is fabricated on a Rogers 5800 substrate with a relative permittivity of 2.2 and a thickness of 0.508 mm. The upper metal conduction band is processed by metal Cu with a thickness of 0.035 mm. mm, the groove of SSP-TL is provided with a transmission line structure of triangular open lines, the port of each triangular open line is connected to the corresponding inner wall of the groove, and the groove structure is connected between the port and the connection point of the groove structure according to The preset ratio is divided, and the adjacent triangular opening lines do not intersect; the triangular opening line is a microstrip line. In the preparation process of the PCB, the structure of the triangular opening line is simple, which is conducive to the layout of the transmission line on the PCB. The triangular opening line A route can be viewed as a ...

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Abstract

The invention relates to the technical field of electronic devices, in particular to an artificial surface plasmon transmission line based on a Delta Stubs structure. It mainly includes a transmission line. The transmission line structure includes two layers. The upper layer is a metal conduction band, and the lower layer is a substrate substrate. The metal conduction band is a groove structure, and the depth of the groove determines the degree of color. The groove The inner two arms are respectively provided with triangular open line ports, and the connection points between the ports and the groove structure divide the groove structure according to a preset ratio, and adjacent triangular open lines do not intersect. By setting a triangular open line on the inner wall on both sides of the SSP-TL, the length of the wavelength transmission line of each groove arm is reduced, the size and structure of the SSP-TL are reduced, and the miniaturization of the SSP-TL is realized; at the same time Since the triangular opening line has a simple structure, it can be realized through a simple process, which is beneficial to popularization and application.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to an artificial surface plasmon transmission line based on a Delta Stubs structure. Background technique [0002] Artificial surface plasmon transmission line (Spoof Surface Plasmon Transmission Line, SSP-TL) is widely used in microwave circuits, such as filters, leaky wave antennas, power dividers, etc. The SSP-TL with the traditional unit structure is composed of a grooved metal conduction band and a substrate substrate, which has weak control ability to the electromagnetic field. Usually, the way to increase the dispersion and enhance the binding ability of the electromagnetic field is to increase the depth of the groove, but because the groove The depth of the groove is limited, and a substantial increase in the depth of the groove can only be achieved by increasing the height of the groove arm, which will inevitably increase the size of the SSP-TL. Contents of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/00
Inventor 庞忠萱孙茜茜吕浩杰周波
Owner NANJING UNIV OF POSTS & TELECOMM
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