A method and device for detecting aggregation of defect points

Abstract

The invention discloses a method and a device for detecting aggregation of defect points, relates to the technical field of automatic optical detection, improves the detection efficiency and accuracyof detecting whether the defect points in a defect point graph have aggregation, and adopts the main technical scheme that obtaining a to-be-detected defect point graph, a partition mode, the number of partitions and a variance threshold value are obtained; carrying out region segmentation processing on the defect point graph to be detected according to the partitioning mode and the partitioning number so as to obtain a plurality of partitions; determining the number of defect points corresponding to each partition, and calculating a normalized proportion value corresponding to each partitionaccording to the number of defect points corresponding to each partition; calculating variance values corresponding to the plurality of normalized proportion values; judging whether the variance valueis greater than the variance threshold or not; and if yes, determining that the defect points in the to-be-detected defect point graph have aggregation. The method is applied to the process of detecting whether the defect points in the defect point graph have aggregation or not.

Description

technical field [0001] The invention relates to the technical field of automatic optical detection, in particular to a method and device for detecting the concentration of defect points. Background technique [0002] With the continuous development of science and technology, AOI (Automatic Optical Inspection) technology has been widely used in the electronics manufacturing industry. In the manufacturing process of the array substrate, it is very important to detect whether the defect points on the array substrate are aggregated. During the AOI inspection process of the AOI inspection equipment on the array substrate, the AOI inspection equipment will record the coordinates of each defect point on the array substrate according to the preset coordinate system, and after the inspection is completed, according to each defect point recorded The corresponding coordinates are used to draw a defect point map corresponding to the array substrate, and according to the defect point ma...

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Problems solved by technology

[0004] In the process of realizing the present invention, the inventor found the following technical problems in the prior art. Because the number of defect point maps that need to be detected is too large, when the staff detects all the defect point maps, it must be It takes a lot of time; moreover, the detection standards of different staff are not uniform, so the accuracy of the detection results cannot be guaranteed. Therefore, the detection efficiency of manual detection to detect whether the defect points in the defect point map are clustered is low. poor accuracy

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