A wafer positioning method and device
A technology of predetermined positions and discs, used in the field of communications
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Embodiment 1
[0092] The method embodiment provided in Embodiment 1 of the present application may be executed in a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, figure 1 It is a block diagram of the hardware structure of a mobile terminal of a wafer positioning method according to an embodiment of the present invention, as figure 1 As shown, the mobile terminal 10 may include one or more ( figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. Optionally, the above-mentioned mobile terminal also A transmission device 106 for communication functions as well as input and output devices 108 may be included. Those of ordinary skill in the art can understand that, figure 1 The shown structure is only for illustration, and does not limit the structu...
Embodiment 2
[0179] In this embodiment, a wafer positioning device is also provided, which is used to implement the above embodiments and preferred implementation modes, and what has been explained will not be repeated here. As used below, the term "module" may be a combination of software and / or hardware that realizes a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementations in hardware, or a combination of software and hardware are also possible and contemplated.
[0180] Figure 10 is a block diagram of a wafer positioning device according to an embodiment of the present invention, such as Figure 10 shown, including:
[0181] The first acquisition module 102 is configured to acquire an image of the laser outlet on the control platform where no wafer is placed through the camera, and acquire the pixel coordinate value of the center of the laser outlet in the collected image;
[0182] The second acquis...
Embodiment 3
[0216] An embodiment of the present invention also provides a storage medium, in which a computer program is stored, wherein the computer program is set to execute the steps in any one of the above method embodiments when running.
[0217] Optionally, in this embodiment, the above-mentioned storage medium may be configured to store a computer program for performing the following steps:
[0218] S11, collecting an image of the laser outlet on the control platform where the wafer is not placed through the camera, and obtaining the pixel coordinate value of the center of the laser outlet in the collected image;
[0219] S12, controlling the control platform on which the wafer is placed to move to a predetermined position, and collecting an image including a marking point of the wafer through the camera, and acquiring a pixel at the center of the marking point in the collected image coordinate value;
[0220] S13. Determine the pixel distance interval between the center of the la...
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