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integrated circuit board

An integrated circuit board and circuit technology, which is applied to circuit substrate materials, printed circuit components, and chemical/electrolytic methods to remove conductive materials. characteristics, internal stress and contact porosity, etc.

Active Publication Date: 2021-03-02
林郅燊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, between the large-area ceramic layer interface and the large-area copper layer interface, there are likely to be problems of internal stress and junction porosity, resulting in material defects commonly known as shell patterns, and it can only be formed by unidirectional etching. Therefore, the minimum line spacing can only be equal to the line height, which also limits the characteristics of integrating different power components

Method used

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Embodiment Construction

[0037] The present invention mainly provides an integrated circuit board that can have high-precision fine lines and high-current lines and high lines, and a method for manufacturing conductive film lines related to it, such as figure 1 As shown, the integrated circuit board of the present invention has an insulating carrier 10, a conductive film line 12 is provided on at least one side of the insulating carrier 10, and at least one layer of stacking is covered on a part of the conductive film line 12 Line 20.

[0038] Accordingly, the integrated circuit board can form a low-thickness low-current circuit formed by the conductive film circuit 12 on the same surface of the insulating carrier 10, and a relatively thick circuit formed by the conductive film circuit 12 combined with the stacked circuit 20. High-current circuits can integrate low-power control circuits and high-power electronic components on the same circuit board, and enable high-power electronic components to also...

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Abstract

The present invention relates to an integrated carrier board with reduced line pitch and integrated different line heights. The novel structure lies in that the line that utilizes the structure of the line stack to achieve the large and small current can be integrated on the same insulating carrier to integrate all the electronic Components on the same carrier, and by way of stacking lines and two-way etching method to achieve smaller pitch, so that high-power components can also reduce the distance between the electrical pins, and then by the integration effect to reduce the overall cost of the structure.

Description

technical field [0001] The present invention relates to an integrated circuit board, in particular to an integrated circuit board with high-precision fine lines and high-current lines and high lines, and a method for manufacturing conductive film lines related thereto. Background technique [0002] Ceramic copper-clad laminate is an important component of high-voltage and high-power IGBT modules. It has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as high conductivity and excellent welding performance of oxygen-free copper. And it can etch various circuit patterns like a PCB circuit board. [0003] A known method for selective metallization on a ceramic substrate uses direct bonded copper (DBC) technology to sinter and bond a ceramic layer with a metal layer such as a copper layer at a high temperature. After sintering, the ceramic The bonding force between the layers and the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/06H05K1/03H05K1/09
Inventor 林郅燊
Owner 林郅燊
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