Flexible temperature-strain integrated sensor array and preparation method thereof

A technology of integrated sensors and temperature sensors, applied in the field of sensors, can solve problems such as difficult layout, numerous leads, cumbersome sensor pasting process, etc., and achieve the effect of convenient installation

Active Publication Date: 2019-06-07
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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Problems solved by technology

In practical applications, it is usually necessary to monitor the temperature and strain of the surface of the structure in a distributed manner, and many m...

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  • Flexible temperature-strain integrated sensor array and preparation method thereof
  • Flexible temperature-strain integrated sensor array and preparation method thereof
  • Flexible temperature-strain integrated sensor array and preparation method thereof

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preparation example Construction

[0062] Another aspect of the present invention also provides a method for preparing the flexible temperature-strain integrated sensor array in any one of the above embodiments, including the following steps:

[0063] S1: Material forming: make flexible substrate, copper foil and constantan foil into design size;

[0064] S2: Lamination of foil materials: Lamination of constantan foil and copper foil to the upper and lower sides of the substrate by means of gluing;

[0065]S3: Drilling: Drilling at the preset positive and negative nodes of the temperature sensor;

[0066] S4: Plated through hole: Copper is plated on the hole wall to make the constantan foil and copper foil on both sides of the substrate conductive;

[0067] S5: Patterning: use photochemical methods to pattern the copper foil layer and constantan foil layer to form sensor arrays, leads and pads;

[0068] S6: Covering the protective layer: Cover the sensitive units and leads of the temperature sensor and strain...

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Abstract

The invention discloses a flexible temperature-strain integrated sensor array. The flexible temperature-strain integrated sensor array at least comprises a temperature sensor unit and a strain sensorunit, a positive pole and a negative pole of the temperature sensor unit are formed by imaging a copper foil layer and a constantan foil layer on the two sides of a substrate correspondingly, and thepositive pole and the negative pole are connected through a via hole technology to form a junction; and the strain sensor unit is formed by imaging a constantan foil layer. The sensor array has flexibility and can be directly attached to the surface of a curved surface structure; the temperatures and strain signals of a plurality of measured points can be monitored simultaneously in a distributedmode, and mounting is convenient; a sensitive unit and a lead are integrated on the substrate, no welding point is formed at the test end, and the flexible temperature-strain integrated sensor array especially meets the monitoring demand in a narrow and small space; and a sensor array preparation process is compatible with an FPC process, and high-precision, large-scale and low-cost production canbe achieved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a flexible temperature-strain integrated sensor array and a preparation method. Background technique [0002] At present, in the field of structural health monitoring, temperature and strain are important information related to the health status of structures. Traditional temperature sensors and strain gauges are usually used to monitor engineering structures (such as machinery, bridges, large buildings, aircraft, weaponry, etc.) temperature and strain. In practical applications, it is usually necessary to monitor the temperature and strain of the surface of the structure in a distributed manner, and many measuring points need to be arranged, which leads to problems such as cumbersome sensor bonding process, numerous leads, and difficulty in arranging in a small space. Contents of the invention [0003] In view of the above problems, the present invention proposes a method for...

Claims

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Application Information

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IPC IPC(8): G01D21/02H05K1/02H05K3/06
Inventor 田昕梁晓辉付涛温茂萍刘洋洋
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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