An anti-cracking circuit module and a design method of the anti-cracking circuit module

Abstract

The invention discloses an anti-cracking circuit module and a design method of the anti-cracking circuit module, which can improve the anti-cracking capability of a chip and reduce the success rate ofreverse engineering to the minimum. The anti-cracking circuit module comprises at least two different layout structures. wherein the at least two different layout structures have the same circuit structure and the same metal layer number, each layout structure at least comprises two metal layers, the positions of the connecting holes of each layout structure are the same, and at least one layer of metal wires connected through the connecting holes are different. When a cracker adopts a plurality of chips with different layout structures to carry out layer-by-layer anatomical photographing, the obtained layout data is layout data formed by combining different layout structures, namely wrong layout data, and then a circuit structure diagram extracted according to the images is different from an originally designed circuit structure diagram, so that the anti-cracking capability of the chip is improved.

Description

technical field [0001] The invention belongs to the field of chip security design, and in particular relates to an anti-cracking circuit module and a design method of the anti-cracking circuit module. Background technique [0002] In the field of chip security design, an important protection goal is to prevent cracking, that is, to prevent crackers from obtaining the chip circuit structure, and obtaining the chip circuit structure requires reverse engineering of the chip. Reverse engineering includes package dissection and die analysis of the chip. Package dissection is very simple, while die analysis is more complicated, including multiple links. The first link is to obtain the layered photos of the die, and the subsequent link is to extract the circuit according to the photos. And analysis, so the key point of reverse engineering is to get the layered photos of the die. However, in order to obtain the photo of the lower layer except the top layer, it is necessary to grind...

AI Technical Summary

Problems solved by technology

[0005] Among them, patent 201610530462.3 involves a chip design method to improve the anti-cracking ability of the chip. Although the patent also improves the anti-cracking ability of the chip by designing multiple versions of layout data, the metal wires and connections of different layout data in this patent The holes are all likely to change, which leads to a situation, that is, in the reverse analysis, if the connection holes are different, some metal lines will be suspended, and it is easy to find that the reverse analysis is incorrect, which reduces the chip's defense. ability to crack

like Figure 13 ~ Figure 15 shown, where Figure 13 It is a layout structure of a circuit diagram, Figure 14 is another layout structure of the circuit diagram, Figure 15 It is a layout structure obtained by mixing a layer of metal of the first layout structure and a layer of metal of the second layout structure. Figure 15 It can be seen that because the positions of the connection holes of the two structures are different, there will be a situation where the metal line is suspended

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