The invention discloses a notebook computer radiator based on a semiconductor heat pump

A notebook computer and heat sink technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of poor cooling effect of notebook computers, etc.

Pending Publication Date: 2019-05-31
SHENYANG INST OF ENG
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to use the principle of semiconductor heat pump to transfer heat and cool down, s...

Method used

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  • The invention discloses a notebook computer radiator based on a semiconductor heat pump
  • The invention discloses a notebook computer radiator based on a semiconductor heat pump

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Embodiment Construction

[0011] The present invention will be described in detail below in conjunction with the embodiments shown in the accompanying drawings.

[0012] The labels in the figure are: 1. Radiator shell 2. Intake air duct optimization pad 3. Heat pump hot end heat exchange fan 4. Heat pump hot end cooling fin 5. Semiconductor heat pump 6. Heat pump cold end cooling fin 7. Cold end cooling convection fan

[0013] Its structure and composition: the cold end cooling convection fan (7) is connected and fixed with the heat pump cold end cooling fin (6); the semiconductor heat pump (5) is connected with the heat pump cold end cooling fin (6) and the heat pump hot end cooling fin (4) ) is bonded and fixed by heat-conducting materials; the heat exchange fan (3) at the hot end of the heat pump is connected and fixed with the cooling fins (4) at the hot end of the heat pump and inserted into the radiator shell (1) equipped with an air intake duct optimization pad (2) middle.

[0014] The using m...

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Abstract

A notebook computer radiator based on a semiconductor heat pump relates to a radiator which is used for a notebook computer and is different from a traditional air cooling heat exchange radiator. Theradiator is composed of a radiator shell, an air inlet duct optimization cushion block, a heat pump hot end heat exchange fan, heat pump hot end heat dissipation fins, a semiconductor heat pump, heatpump cold end refrigeration fins and a heat pump cold end refrigeration convection fan. The heat pump cold end refrigeration convection fan (7) is fixedly connected with the heat pump cold end refrigeration fins (6); The semiconductor heat pump (5), the heat pump cold end refrigeration fins (6) and the heat pump hot end heat dissipation fins (4) are attached and fixed through heat conduction materials. And the heat pump hot end heat exchange fan (3) and the heat pump hot end radiating fins (4) are connected and fixedly arranged in the radiator shell (1) provided with the air inlet duct optimization cushion block (2). The semiconductor heat pump is used for transferring the temperature of the cold end, and the heat pump cold end refrigeration convection fan is used for carrying out forced convection heat exchange so as to achieve the effect of cooling the D surface of the notebook computer through enhanced heat exchange.

Description

technical field [0001] The invention relates to a notebook computer radiator based on a semiconductor heat pump, and is especially proposed for the poor thermal performance of the active fan of the notebook computer itself. Background technique [0002] Laptops are more and more popular because of their small size and portability, but precisely because of their small size, heat dissipation has become a shortcoming of this type of product. Working for a long time causes high heat-generating components such as CPU and GPU to fail to dissipate heat in time, resulting in excessive temperature and performance degradation. [0003] Starting from the principle and technical defects of most external heat sinks in the market, a new heat dissipation scheme is proposed, and a new type of notebook computer heat sink is innovatively developed. Contents of the invention [0004] The object of the present invention is to use the principle of semiconductor heat pump to transfer heat and ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 潘宏刚庞智元李丽
Owner SHENYANG INST OF ENG
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