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Fiber-integrated interferometer parallel structure three-dimensional space distributed deformation sensor

A deformation sensor and three-dimensional space technology, applied in the direction of instruments, measuring devices, optical devices, etc., can solve the problems of spectral demodulation and aliasing at detection points, and achieve the elimination of temperature cross-sensitivity effects, convenient use, and overall volume reduction Effect

Active Publication Date: 2021-09-28
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
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  • Claims
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Problems solved by technology

The disadvantage is that when the number of long-chirped fiber gratings increases, the spectral demodulation of the detection point is prone to aliasing

Method used

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  • Fiber-integrated interferometer parallel structure three-dimensional space distributed deformation sensor
  • Fiber-integrated interferometer parallel structure three-dimensional space distributed deformation sensor
  • Fiber-integrated interferometer parallel structure three-dimensional space distributed deformation sensor

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Comparison scheme
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Embodiment

[0033] Example: figure 1 It is a structural schematic diagram of a fiber-integrated interferometer parallel-connected three-dimensional space distributed deformation sensor, and it is also a specific implementation mode of the sensor.

[0034] In order to analyze the optical path difference of the four fiber cores of the helical quadruple fiber 1-1 due to bending, the establishment of Image 6 The reference coordinates of the shown helical quadruple-core optical fiber 1-1 in a bent state. for Image 6 In the bending coordinate system of the helical four-core optical fiber 1-1, it is assumed that the length of a helical four-core optical fiber 1-1 is L, and the three outer cores 1-1b / 1-1c / 1-1d to the central core 1-1a The distance is r.

[0035] The optical path calculation is determined by the following formula:

[0036] L=n eff l\*MERGEFORMAT (3)

[0037] In the formula, L is the scanning distance of the translation stage, n effis the effective refractive index of the ...

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Abstract

The invention discloses a fiber-integrated interferometer parallel structure three-dimensional space distributed deformation sensor. The strain sensor is integrated on an optical fiber. The sensor provided by the present invention is a multi-core optical fiber sensor array with a distributed three-dimensional space structure, each sensor corresponds to measuring discrete strain information and curvature information, and simulates the three-dimensional shape of the structure space by demodulating these information Combined reconstruction, in order to establish the mapping relationship between the white light interference sensor array arm length displacement parameter and the sensed three-dimensional shape of space. Due to the inherent characteristics of the present invention, it can also be applied under high temperature conditions. In addition, the optical fiber sensor also has the advantages of high sensitivity, compact structure and low cost.

Description

(1) Technical field [0001] The invention belongs to the technical field of optical fiber sensing, and in particular relates to a three-dimensional space distributed deformation sensor with a parallel structure of fiber integrated interferometers. (2) Background technology [0002] Optical fiber deformation sensing is a distributed sensing technology, which uses the backscattering signal generated by the local deformation of the optical fiber to measure bending and twisting, and then calculates and processes the information to reconstruct the three-dimensional spatial deformation information of the optical fiber. . Based on this, this technology has broad application prospects in the fields of medical treatment, national defense, aerospace and other intelligent structure detection. [0003] In 1979, the National Aeronautics and Space Administration (NASA) proposed to implant fiber optic sensors into the composite skin of the aircraft to construct intelligent structures and d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/16
Inventor 苑立波李文超
Owner GUILIN UNIV OF ELECTRONIC TECH
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