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Display substrate, method for manufacturing the same, and display device

A technology for display substrates and substrate substrates, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of polarizer fading and affecting the display effect of display devices, so as to reduce the risk of reaction and the risk of fading Risks, Effects of Improving Display Effects

Active Publication Date: 2021-01-26
BOE TECH GRP CO LTD
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  • Claims
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Problems solved by technology

[0004] However, NH 3 、SiH 4 and N 2 During the reaction process, ammonium ions will be generated. After forming the thin film encapsulation layer, part of the ammonium ions will remain in the thin film encapsulation layer. During the use of the display substrate, these ammonium ions will overflow from the thin film encapsulation layer in the form of ammonia gas. The polarizer reacts, causing the polarizer to fade and affecting the display effect of the display device

Method used

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  • Display substrate, method for manufacturing the same, and display device
  • Display substrate, method for manufacturing the same, and display device
  • Display substrate, method for manufacturing the same, and display device

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Embodiment Construction

[0027] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0028] Due to the market demand for flexible displays, TFE technology has been more applied. At present, in the process of manufacturing a display substrate, a thin film encapsulation layer is often formed on the outside of the light emitting device by TFE technology. However, ammonia gas is used in the process of forming the thin film encapsulation layer and ammonium ions are generated. After the thin film encapsulation layer is formed, some ammonium ions will remain ...

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Abstract

The application discloses a display substrate, a manufacturing method thereof, and a display device, which belong to the field of display technology. The display substrate includes a base substrate and a light emitting device layer, a thin film encapsulation layer, an optical adhesive layer and a polarizer disposed on the base substrate in sequence, and the polarizer is attached to the side of the thin film encapsulation layer away from the light emitting device layer through the optical adhesive layer. The optical adhesive layer is doped with ammonia absorber. The present application can reduce the risk of reaction between the ammonia gas overflowing from the thin film encapsulation layer and the polarizer, thereby reducing the risk of fading of the polarizer and improving the display effect of the display device. This application is used to reduce the risk of polarizer fading.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light-Emitting Diode (English: Organic Light-Emitting Diode; abbreviation: OLED) display substrate has the advantage of flexible display, and is widely used in flexible display products. The OLED display substrate includes a base substrate, a light-emitting device layer, an encapsulation layer, and a polarizer (English: Polarizer; POL for short), which are sequentially arranged on the base substrate. The encapsulation layer is mainly used to isolate the light-emitting device layer from the air, and the polarizer It is mainly used for dimming OLED display substrates. [0003] At present, due to market demand for flexible displays, the encapsulation layer is mainly a thin film encapsulation layer formed by thin film encapsulation (English: Thin Film Encapsula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
Inventor 李俊杰张嵩李园园
Owner BOE TECH GRP CO LTD
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