Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

FPC capable of reducing self-twisting stress

A technology of twisting stress and corners, applied in the field of FPC, can solve the problems of easy disengagement of the interface, difficult installation, large stress effect, etc., to achieve the effect of improving connection reliability, increasing reliability, and low reaction force

Pending Publication Date: 2019-05-24
WUHAN JINGLI ELECTRONICS TECH +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at at least one defect or improvement requirement of the prior art, the present invention provides an FPC that can reduce its own twisting stress, the purpose of which is to reduce the stress of the flexible circuit board itself on the connector caused by processing errors, and enhance the reliability of the FPC , It can also reduce the stress of the connector of the printed circuit board and the flexible circuit board, thereby reducing the difficulty of installation, and solving the existing problems of the existing L-shaped FPC board and the installation of the connector. The problem that the interface is easy to disengage after a period of time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • FPC capable of reducing self-twisting stress
  • FPC capable of reducing self-twisting stress
  • FPC capable of reducing self-twisting stress

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0023] figure 2 It is a schematic structural diagram of the first FPC that can reduce its own twisting stress provided by the embodiment of the present invention; figure 2 As shown, the FPC includes a flexible substrate 1 and a wiring layer 2 disposed on the flexible substrate 1; the shape of the wiring layer 2 matches the shape of the flexible substrate 1;

[0024] The flexible substrate 1 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an FPC capable of reducing the self-twisting stress, and belongs to the technical field of circuit boards. The FPC comprises a flexible substrate and a wiring layer arranged onthe flexible substrate. The flexible substrate comprises a horizontal part, a vertical part and a bending part connected with the horizontal part and the vertical part, wherein the width of the bending part is smaller than that of the horizontal part and that of the vertical part, so that a distortion stress acting on the end part of the flexible substrate is transferred to the narrower bending part. According to the invention, the width of the bending part of the flexible substrate is reduced, and corner structures with different angles are arranged at the inner side and the outer side of the bending part, so that the distortion stress generated at the joints where the horizontal part and the vertical part of the flexible substrate are connected with the connector is transferred to the narrower bending part, thereby reducing the distortion degrees of the horizontal part and the vertical part, enabling the connection areas among the horizontal part, the vertical part and the connectorto be more stable, and improving the reliability of a product in the use process.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and more specifically relates to an FPC capable of reducing its own twisting stress. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, FPC), also known as "FPC flexible board", is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have; for example, it can be bent freely, rolled Winding and folding can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. [0003] According to the different require...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 张博佳方欣张巍
Owner WUHAN JINGLI ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products