Stripping method and stripping device of flexible substrate

A technology for flexible substrates and stripping equipment, which is applied in the field of display screens, can solve the problems of damaging the adsorption force of the contact surface, complex stripping procedures and stripping equipment for flexible substrates, and high manufacturing costs for flexible substrates, achieving low manufacturing costs, simple stripping equipment, and easy stripping The effect of simple process

Active Publication Date: 2022-05-17
SHENZHEN ROYOLE TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of the flexible substrate, in order to peel the flexible substrate from the glass substrate, it is usually necessary to irradiate the contact surface of the flexible substrate and the glass substrate with a laser, so as to destroy the adsorption force of the contact surface, and then use a knife to cut into the glass substrate and the flexible display. and further peel off the flexible substrate, the peeling process and peeling equipment of the flexible substrate are more complicated, and the manufacturing cost of the flexible substrate is high

Method used

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  • Stripping method and stripping device of flexible substrate
  • Stripping method and stripping device of flexible substrate
  • Stripping method and stripping device of flexible substrate

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Embodiment Construction

[0038] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

[0039] In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0040] In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simpl...

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Abstract

A method for peeling off a flexible substrate (20) and a peeling device (10). The peeling method is used to peel off the flexible substrate (20) and the glass substrate (30). The peeling method includes: (S1) cutting the glass substrate (30) of a predetermined size into a cut section (31); (S3) clamping the cut section ( 31) and the flexible substrate (20) corresponding to the interception section (31); and (S5) move the clamped interception section (31) and the flexible substrate (20), so that the interception section (31) separates from the glass substrate (30) ) separating and peeling off the flexible substrate (20) and the glass substrate (30).

Description

technical field [0001] The invention relates to the technical field of display screens, in particular to a peeling method and peeling equipment for a flexible substrate. Background technique [0002] In the manufacturing process of the flexible substrate, in order to peel the flexible substrate from the glass substrate, it is usually necessary to irradiate the contact surface of the flexible substrate and the glass substrate with a laser, so as to destroy the adsorption force of the contact surface, and then use a knife to cut into the glass substrate and the flexible display. The flexible substrate is further peeled off, the peeling process and the peeling equipment of the flexible substrate are relatively complicated, and the manufacturing cost of the flexible substrate is high. Contents of the invention [0003] Embodiments of the present invention provide a peeling method and peeling equipment for a flexible substrate. [0004] The peeling method of the flexible subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/13
Inventor 曹荣刘志强
Owner SHENZHEN ROYOLE TECH CO LTD
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