Packaging structure and packaging method of LED shoe light

Abstract

The invention discloses a packaging structure of an LED shoe lamp, belonging to the technical field of shoe lamp processing. The packaging structure comprises a transparent substrate and a plurality of PCB boards arranged on the bottom surface of the transparent substrate. Trapezoid table, both ends of the transparent trapezoid table are open, the side wall of the transparent trapezoid table is provided with several through holes at 1 / 3 of the bottom, and the inner wall of the side wall of the transparent trapezoid table is evenly arranged on the surface at 1 / 3 of the bottom. Point-like protrusions; the invention also discloses a packaging method for the LED shoe light, which applies the above-mentioned packaging structure of the LED shoe light. The packaging structure of the LED shoe light ensures better heat dissipation of the LED light beads without affecting the light transmittance of the LED light beads, and can also protect the LED light beads well. The packaging method of the LED shoe light is suitable for For the packaging of LED shoe lights, the packaging process is simple, no need to use too many large mechanical equipment, easy to operate and save energy.

Description

technical field [0001] The invention belongs to the technical field of shoe lamp processing, and in particular relates to a packaging structure and a packaging method of an LED shoe lamp. Background technique [0002] The packaging of LED shoe lights is similar to the packaging of most LED lights. The LED lights are assembled on the substrate with chips, then the positive and negative electrodes are welded, and finally the whole is packaged with glue. Although this traditional encapsulation method can effectively protect the LED lights, the strong airtightness of the potting compound will affect the heat dissipation and light transmission of the LED lights, especially the shoe lights, which are mostly installed in the upper. Or in the sole of the shoe, the light will be blocked and weakened by the shoe material itself. If the light is affected by the potting glue, the luminous effect of the shoe light will be greatly reduced. The existing research mainly focuses on the impro...

AI Technical Summary

Problems solved by technology

Although this traditional encapsulation method can effectively protect the LED lights, the strong airtightness of the potting compound will affect the heat dissipation and light transmission of the LED lights, especially the shoe lights, which are mostly installed in the upper. Or in the sole of the shoe, the light will be blocked and weakened by the shoe material itself. If the light is affected by the potting glue, the luminous effect of the shoe light will be greatly reduced. The existing research mainly focuses on the improvement of the packaging of ordinary LED lights. For example, the application number is 201010123574X , 201110252496.8 Chinese patent, but because most of the shoe lights are installed on the soles, they are under pressure from the human body for a long time, which is different from ordinary LED lights

Images