Vibration device for test handler

Abstract

The present invention relates to a vibration device for a test handler. More specifically, according to an embodiment of the present invention, a vibration device for a test handler includes a conveyor belt for conveying a tray in one direction; a roller provided on both sides of the conveyor belt and rotated in engagement with the conveyor belt; a belt supporting portion provided between the rollers on both sides of the conveyor belt and supporting the conveyor belt so that the tray and the conveyor belt come into close contact with each other; a separation preventing portion for preventing the tray from separating from the conveyor belt; an oscillating unit for applying a vibration to at least one of the belt supporting portion and the deviation preventing portion; and a position adjusting unit for moving the tray so that the tray contacts the departure prevention part excited by the vibrating unit.

Description

technical field [0001] The invention relates to a vibration device applied to a test processor. Background technique [0002] In order to test electronic components (especially semiconductor elements), a tester (TESTER) for testing electrically connected electronic components and a device for electrically connecting electronic components to the tester, that is, a test handler (TESTHANDLER) are required. [0003] The test handler uses a test tray (TEST TRAY) that can be transported at one time in a state where a plurality of semiconductor elements are loaded in a matrix in order to increase the processing capacity. [0004] Since the semiconductor element is electrically connected to the test socket (TEST SOCKET) of the tester when it is loaded on the test tray (also called the carrier board), the distance between the semiconductor elements loaded on the test tray needs to be Corresponds to the interval between test sockets of the tester. [0005] On the other hand, the sem...

AI Technical Summary

Problems solved by technology

[0014] The customer tray CT2 whose loading of semiconductor components has been completed will be moved to the stacker (installed at the storage place of the customer tray CT2 of the test processor) and stacked for storage. In the above case, cracks (cracks) may appear on the semiconductor element out of the bag, or the terminal (BGA type Ball in BGA type) located at the lower part of the semiconductor element may be damaged

[0015] In addition, since user trays may not be continuously stacked horizontally on top, when the stacked user trays are taken out from the unloading stacker, the user trays cannot be transported correctly, and semiconductor components in the user trays may be lost. Questions where the likelihood will increase

[0016] In addition, the present applicant attempts to return the semiconductor element in the disengaged state to the bag by installing four or six vibration motors, and utilizing the excitation force of the vibration motors, but, with the use of a larger number (for example: six ) motors, the management of vibration motors becomes complicated, and the weight increases excessively due to multiple vibration motors.

Images