An e-waste recycling device that prevents sucked-out solder from reflowing through the bracket limit

Abstract

The invention discloses an electronic waste recovery device that prevents sucked-out solder from reflowing through the limit of a bracket. The side end surface is flexibly connected with the device housing at the same time, and the card slot is located inside the device housing and is movably connected with the device housing. After the solder is melted by high temperature, the upper rod is pressed down, so that the lower special-shaped rod continues to press down. Therefore, the rollers are used to move the special-shaped rod to make the front push rod frame move forward, and the internal filaments are fixed by the push rod frame through the inward joint of both ends without manual manipulation. At the same time, it is absorbed by the negative pressure tube and soldered at the same time. It is sucked out and clamped on the matching frame, and the solder is cooled under the cooling of the gas flow, and is recycled to the interior of the disconnected collection chamber through the scraper and the inclined plate, thereby preventing the secondary solidification of the solder.

Description

technical field [0001] The invention relates to the field of motor waste recycling, in particular to an electronic waste recycling device that prevents sucked-out solder from reflowing through the limit position of a bracket. Background technique [0002] The current solder recovery device usually uses negative pressure inching to melt the solder at high temperature, and then manually moves the fixed electrical appliance to join the filaments, sucking the solder out and placing it inside the same pipeline, but this method is likely to cause: [0003] When performing recycling work, by placing the solder inside the same pipe, it is easy to condense the internal solder again during the secondary recovery work, and when it is adsorbed, the internal solder is easy to stick to the inner wall of the equipment, so that Solder spots are easily formed inside the recovery device, which will affect the next recovery work. At the same time, the filament needs to be moved manually. The s...

AI Technical Summary

Problems solved by technology

[0002] The current solder recovery device usually uses negative pressure inching to melt the solder at high temperature, and then manually moves the fixed electrical appliance to join the filaments, sucking the solder out and placing it inside the same pipeline, but this method is likely to cause:

[0003] When performing recycling work, by placing the solder inside the same pipe, it is easy to condense the internal solder again during the secondary recovery work, and when it is adsorbed, the internal solder is easy to stick to the inner wall of the equipment, so that Solder spots are easily formed inside the recovery device, which will affect the next recovery work. At the same time, the filament needs to be moved manually. The smoke generated after the temperature-sensitive melting of the solder will affect the identification ability of the staff, making it difficult to remove the electrical filament. Find out the work that affects recycling

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