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Dry film application device for production of thick copper PCBs

A PCB board and dry film technology, which is applied in the field of dry film application devices for thick copper PCB board production, can solve the problems of lateral movement of PCB boards, affecting production efficiency, and affecting the effect of film application, so as to avoid lateral offset, Improve the effect of the film, the effect of a good angle

Pending Publication Date: 2019-04-16
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the design of the traditional dry film application device still has deficiencies. Its clamping and limiting structure can only be limited in two directions, which will cause the PCB board to move laterally during the film application process, which will affect the film application effect. The clamping limit structure cannot be rotated, it is not convenient to adjust the rotation angle of the PCB board, and it is not convenient to better adapt to the dry film, which seriously affects the production efficiency and brings a lot of trouble to people

Method used

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  • Dry film application device for production of thick copper PCBs
  • Dry film application device for production of thick copper PCBs
  • Dry film application device for production of thick copper PCBs

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] Please refer to figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 ,in, figure 1 It is a front view sectional structure schematic diagram of a preferred embodiment of the thick copper PCB board production dry film application device provided by the present invention; figure 2 for figure 1 The enlarged schematic diagram of part A shown; image 3 for figure 1 The enlarged schematic diagram of part B shown; Figure 4 for figure 1 The enlarged schematic diagram of part C shown; Figure 5An assembly drawing of the first bevel gear and the second bevel gear in the dry film application device for thick copper PCB board production provided by the present invention. The dry film application device for thick copper PCB board production includes: a base 1; a turntable 2, the turntable 2 is rotatably mounted on the base 1; a film sticking ...

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Abstract

The invention provides a dry film application device for the production of thick copper PCBs. The dry film application device for the production of thick copper PCBs comprises a base, a turntable, a film application structure, a rotating structure, a second motor and a first transmission structure. The turntable is rotationally installed on the base. The film application structure is arranged on the top of the base, and includes a first motor, a support rod and a push rod motor, wherein the first motor is fixedly installed on the top of the base. The rotating structure is arranged on the base,and includes a first groove, a first rotating shaft, a second groove and a first sprocket. The second motor is fixedly installed on one side of the base. The first transmission structure is arrangedon the base. The dry film application device for production of thick copper PCBs provided by the invention has the advantages of convenience of use, four-way clamping and limiting, avoidance of lateral displacement, easy rotation and adjustment of angle, and improvement of production efficiency.

Description

technical field [0001] The invention relates to the technical field of PCB board production equipment, in particular to a dry film sticking device for thick copper PCB board production. Background technique [0002] PCB board, also known as printed circuit board, uses an insulating board as the base material and cuts it to a certain size. At least one conductive pattern is attached to it, and holes (such as component holes, fastening holes, metallized holes, etc.) It replaces the chassis of the electronic components in the past and realizes the interconnection between electronic components. There are many types, and the thick copper PCB board is one of the very important ones. With the continuous development of science and technology, the thick copper PCB board is widely used. In various fields, the dry film application device is the key equipment in the production process of thick copper PCB boards, which greatly improves the production efficiency. [0003] However, the de...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0008H05K3/06
Inventor 吴建明黄勇曹德华
Owner AOSHIKANG TECH CO LTD
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