Dry film application device for production of thick copper PCBs
A PCB board and dry film technology, which is applied in the field of dry film application devices for thick copper PCB board production, can solve the problems of lateral movement of PCB boards, affecting production efficiency, and affecting the effect of film application, so as to avoid lateral offset, Improve the effect of the film, the effect of a good angle
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[0023] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0024] Please refer to figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 ,in, figure 1 It is a front view sectional structure schematic diagram of a preferred embodiment of the thick copper PCB board production dry film application device provided by the present invention; figure 2 for figure 1 The enlarged schematic diagram of part A shown; image 3 for figure 1 The enlarged schematic diagram of part B shown; Figure 4 for figure 1 The enlarged schematic diagram of part C shown; Figure 5An assembly drawing of the first bevel gear and the second bevel gear in the dry film application device for thick copper PCB board production provided by the present invention. The dry film application device for thick copper PCB board production includes: a base 1; a turntable 2, the turntable 2 is rotatably mounted on the base 1; a film sticking ...
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