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Method for forming semiconductor structure

A semiconductor and coupling agent technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of difficult manufacturing process, increasing the complexity of processing and making integrated circuits, etc.

Inactive Publication Date: 2019-03-29
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, these advances have increased the complexity of handling and fabricating integrated circuits
As part feature sizes continue to shrink, the manufacturing process becomes progressively more difficult
Therefore, it is a challenge to form reliable semiconductor devices in smaller and smaller sizes

Method used

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  • Method for forming semiconductor structure
  • Method for forming semiconductor structure
  • Method for forming semiconductor structure

Examples

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Embodiment Construction

[0044] The following content provides many different embodiments or examples for implementing different components of the embodiments of the present invention. Specific examples of components and configurations are described below to simplify embodiments of the invention. Of course, these are just examples, not intended to limit the embodiments of the present invention. For example, if a description mentions that a first component is formed on or over a second component, it may include an embodiment in which the first and second components are in direct contact, or may include an additional component formed on the first and second components between, such that the first and second components are not in direct contact with each other. Additionally, embodiments of the invention may repeat component symbols and / or letters in many instances. These repetitions are for the purposes of simplicity and clarity and do not in themselves imply a specific relationship between the various...

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Abstract

The present invention provides a method for forming a semiconductor device structure. The method includes forming a material layer over a substrate and forming a resist layer over the material layer.The resist layer includes an inorganic material and an auxiliary. The inorganic material includes a plurality of metallic cores and a plurality of first linkers bonded to the metallic cores. The method includes exposing a portion of the resist layer. The resist layer includes an exposed region and an unexposed region. In the exposed region, the auxiliary reacts with the first linkers. The method also includes removing the unexposed region of the resist layer by using a developer to form a patterned resist layer. The developer includes a ketone-based solvent having a formula (a), wherein R1 islinear or branched C1-C5 alkyl, and R2 is linear or branched C3-C9 alkyl.

Description

technical field [0001] Embodiments of the present invention relate to a method for forming a semiconductor structure, in particular to a method for forming a semiconductor structure using a ketone-based solvent. Background technique [0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. In general, by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor material layers on a semiconductor substrate, and patterning various material layers using lithography to form circuit components and components thereon, To manufacture semiconductor devices. Typically multiple integrated circuits are fabricated on a single semiconductor wafer, and dicing lines are diced between the integrated circuits to separate the individual chips on the wafer. These individual chips are often packaged separately, eg in multi-chip modules, or in oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027H01L21/336
CPCH01L21/0274H01L29/66795
Inventor 訾安仁张庆裕林进祥
Owner TAIWAN SEMICON MFG CO LTD
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