Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Overturning feeding device of IC chip testing machine

A chip testing and chip technology, which is applied in conveyor control devices, conveyors, and unstacking of objects, can solve problems such as material jams and IC chips cannot be slipped out, and achieve the effect of improving reliability

Pending Publication Date: 2019-03-22
昆山宇辰光通自动化科技有限公司
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] And the feeding mechanism of existing automatic sorting machine, as publication number is the Chinese invention patent of CN106311633A, has announced a kind of integrated circuit chip multi-station serial band marking test sorting device, and its feeding mechanism is arranged by inclination The inclined track in the middle sends the IC chip into the material track. This structure can easily cause the IC chip to fail to slide out, resulting in material jams, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Overturning feeding device of IC chip testing machine
  • Overturning feeding device of IC chip testing machine
  • Overturning feeding device of IC chip testing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] Embodiment: a kind of flip feeding device of IC chip testing machine, as Figure 1 to Figure 7 As shown: it includes a loading platform 1002 for placing an IC material tube 1001, a feeding mechanism 1003 for taking out the IC chips in the IC material tube, and a material channel 1004 for transporting the IC chips. It is set horizontally, and the forehearth is perpendicular to the loading platform;

[0045] The loading platform is provided with a material bin 1005 and a push mechanism 1006, the IC material tubes are horizontally stacked in the material bin, the push mechanism is located at the bottom of the material bin, and the push mechanism includes a material tube slide block 10061 and a drive unit 10062 for driving the tube slider capable of holding one of the IC tubes in the bin and pushing it out to the loading unit through the drive unit the intended location of the station;

[0046] In this embodiment, the drive unit includes a servo motor, a synchronous belt ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an overturning feeding device of an IC chip testing machine. The overturning feeding device comprises a material carrying table used for placing an IC material pipe, a feedingmechanism used for taking an IC chip out, and a material channel used for conveying the IC chip. The material carrying table is provided with a material cabin and a push mechanism. The push mechanismcan clamp the IC material pipe in the material cabin and push the IC material pipe out to a preset position of the material carrying table. The feeding mechanism comprises a clamping mechanism used for clamping the IC material pipe on the material carrying table, and an overturning mechanism. The clamping mechanism can clamp the IC material pipe. The overturning mechanism drives the clamping mechanism to overturn, and therefore the clamped IC material pipe is perpendicular to the material carrying table and communicates with the material channel, and the IC chip in the IC material pipe can slide into the material channel from the IC material pipe. The overturning mechanism overturns the clamping mechanism clamping the IC material pipe, and therefore the clamping mechanism is changed from ahorizontal state to a vertical state, so that the IC chip in the IC material pipe slides into the material channel communicating with the IC material pipe.

Description

technical field [0001] The invention belongs to the technical field of automation equipment, and in particular relates to a feeding mechanism of an IC testing machine. Background technique [0002] IC chip (Integrated Circuit integrated circuit) is to put a large number of microelectronic components (transistors, resistors, capacitors, etc.) It is called an IC chip. The integrated circuit chip must undergo strict testing before leaving the factory. The test items include various performance parameters of the integrated circuit chip, such as current and voltage. People need to screen out the integrated circuit chips whose test results are not within the qualified range, and Classify integrated circuit chips with different test results. There are many packaging methods for IC chips, such as tube packaging types. Figure 8 As shown: the IC chip 2009 is stored in the tubular IC material tube 1001, and the chips in the material tube need to be taken out one by one for testing dur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/248B65G59/06B65G43/08
CPCB65G43/08B65G47/248B65G59/067B65G2203/042
Inventor 张英乾张博
Owner 昆山宇辰光通自动化科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products