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Heat bonding sheet, and heat bonding sheet with dicing tape

A technology for cutting tapes and sheets, used in conductive adhesives, inorganic adhesives, adhesive additives, etc., can solve problems such as thermal characteristics and reliability problems

Pending Publication Date: 2019-03-12
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semiconductor devices for applications with harsh thermal environments are supposed to operate at high temperatures of around 250°C, and solder and conductive adhesives, which have been conventional bonding / adhesive materials, have problems in terms of thermal characteristics and reliability.

Method used

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  • Heat bonding sheet, and heat bonding sheet with dicing tape
  • Heat bonding sheet, and heat bonding sheet with dicing tape
  • Heat bonding sheet, and heat bonding sheet with dicing tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3 and comparative example 1

[0166] 100 parts by weight of a paste containing sinterable metal particles, 7 parts by weight of a pyrolytic binder shown in Table 1, and 45 parts by weight of an organic solvent were put into a rotation / revolution mixer (manufactured by THINKY CORPORATION, ARE-310), and Stir at 2000rpm for 8 minutes to make varnish. The obtained varnish was applied on a release treatment film (manufactured by Mitsubishi Plastics Corporation, "MRA38"), and dried. Coating was performed using an applicator so that the thickness of the dried coating film would be 70 μm. Drying is carried out using an explosion-proof dryer. Drying conditions were set at 80° C. for 2 minutes. Thus, a sheet for thermal bonding with a thickness of 70 μm was obtained.

[0167] "evaluate"

[0168] The samples of Examples and Comparative Examples were evaluated for the following items. Table 1 shows the respective results.

[0169] (SEM observation of phase separation structure and measurement of the maximum diam...

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PUM

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Abstract

A sheet for heat bonding which can provide sufficient bonding reliability for a power semiconductor device by suppressing inhibition of sintering of sinterable metal particles by an organic component,and a heat bonding sheet with a dicing tape which comprises said sheet for heat bonding are provided. The sheet for heat bonding has a precursor layer which becomes a sintered layer by heating, wherein the precursor layer contains sinterable metal particles and an organic component, the precursor layer is a phase-separated structure which is a sea-island structure or a co-continuous structure, and, in an SEM surface microscopy image of at least one surface of the precursor layer, the largest value of the diameters of the maximum inscribed circles in regions occupied by each phase of the phase-separated structure is 1-50[mu]m.

Description

technical field [0001] The present invention relates to a sheet for thermal bonding and a sheet for thermal bonding with a dicing tape. Background technique [0002] In the manufacture of semiconductor devices, the method of bonding semiconductor elements to adherends such as metal lead frames (so-called die bonding method) has evolved from the conventional gold-silicon eutectic to methods using solder and resin paste . Currently, conductive resin pastes are sometimes used. [0003] However, in the method of using a conductive resin paste, the generation of voids may lead to a decrease in conductivity, uneven thickness of the paste, contamination of pads due to bleeding, and the like. [0004] On the other hand, in recent years, the spread of power semiconductor devices that control and supply electric power has become remarkable. Since current always flows through the power semiconductor device, it generates a large amount of heat. Therefore, it is desired that a conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J7/00C09J11/06C09J11/08H01L21/52
CPCC09J2400/16C08K3/08C08K3/10C09J9/00C09J11/04H01L21/52C09J2203/326H01L2224/48091H01L2224/73265H01L2224/83191C09J7/10C09J2301/408H01L2924/00014C09J7/385C09J1/00C09J9/02H01J37/28H01L21/6836H01L21/78H01L24/27H01L24/32H01L24/83H01L2224/83203H01L2924/01029H01L2924/01047H01L2924/01079
Inventor 本田哲士菅生悠树镰仓菜穗
Owner NITTO DENKO CORP
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