A dustproof computer chassis

A computer host and chassis technology, applied in electrical digital data processing, digital processing power distribution, instruments, etc., can solve the problems of difficult dust prevention, affect heat dissipation performance, damage to electronic components, etc., to prevent dust from entering, enhance heat dissipation performance, well-structured effect

Inactive Publication Date: 2019-03-12
高邮天霖恒科教育咨询有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many air intake and exhaust holes for heat dissipation on the existing main chassis. The dust outside the chassis will enter the interior of the chassis with the flowing air, and the dust will accumulate on the circuit board near the radiator, endangering the circuit board. The working stability of electronic components, and even cause damage to these electronic components
However, if the chassis is made fully enclosed, it will affect the heat dissipation performance. Therefore, how to improve the dust-proof effect of the main chassis and ensure its heat dissipation performance is a difficult point for the dust-proof problem of the computer main chassis.

Method used

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  • A dustproof computer chassis
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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0022] In the drawings of this embodiment, the same or similar symbols correspond to the same or similar components; The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orien...

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PUM

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Abstract

The invention discloses a dustproof computer main chassis. The chassis comprises a fully enclosed enclosures, the fully enclosed chassis comprises a chassis body and a left side plate rotatably connected with the chassis body through a rotating shaft, a right side panel, the left side panel, one side edge of the right side plate is connected with the rear panel of the chassis body through a fastening device, one end of the fastening device and a left side plate, the other side of the right panel is hinged, The other end of the fastening device is connected with the rear plate clasp of the chassis body, the left side plate and the right side plate are fixedly connected with the sealing gasket at the connection with the chassis body, and the right side plate is provided with a heat dissipation device, which comprises a miniature vacuum pump, a heat pipe group, an air exchange box, a gas pipe, a heat dissipation fin, a fan and a cover body. The dust-proof computer chassis of the inventionhas a reasonable structure, and the dust-proof performance of the chassis is improved while the heat dissipation performance is guaranteed.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a dustproof main computer box. Background technique [0002] The computer main case is an important part of computer accessories, mainly used to place and fix various computer accessories, and play a role of support and protection. There are many air intake and exhaust holes for heat dissipation on the existing main chassis. The dust outside the chassis will enter the interior of the chassis with the flowing air, and the dust will accumulate on the circuit board near the radiator, endangering the circuit board. The working stability of electronic components may even cause damage to these electronic components. However, if the chassis is made fully enclosed, it will affect the heat dissipation performance. Therefore, how to improve the dustproof effect of the mainframe chassis while ensuring its heat dissipation performance is a difficult point for the dustproof prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 叶鹏云
Owner 高邮天霖恒科教育咨询有限公司
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