A copper-aluminum bonded metal substrate processing method

Abstract

The invention provides a copper aluminum combination metal substrate processing method. The copper aluminum combination metal substrate is used for manufacturing a thermoelectric separation plate andcomprises a first copper foil layer, an insulating layer, a copper plate, an aluminum plate and an aluminum plate protection membrane, which are laminated from the top to the bottom. The method comprises the following steps: tearing off the aluminum plate protection membrane on the copper aluminum combination alloy metal substrate; pasting a high temperature tape below the aluminum plate; overlaying a PP sheet and a second copper foil layer below the high temperature tape, wherein the second copper foil layer is located below the PP sheet, and then laminating; using an alkali etching method toremove the copper foil on the first copper foil layer corresponding to a laser slotting or laser drilling position when the thermoelectric separation plate is manufactured; carrying out laser slotting or laser drilling on an insulating layer; then, performing electroplating; uncovering after electroplating; and tearing off the laminated high temperature tape, the PP sheet and the second copper foil layer.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for processing copper-aluminum bonded metal substrates used in thermoelectric separation circuit boards. Background technique [0002] At present, the most commonly used heat sink material for PCB metal substrates is copper or aluminum alloy. Aluminum alloy is easy to process and low in cost, so it is also the most widely used material. In contrast, the instantaneous heat absorption capacity of copper is better than that of aluminum alloy, but the speed of heat dissipation is slower than that of aluminum alloy. Considering the respective shortcomings of copper and aluminum, some high-end car LED headlights and mining machine acceleration chips in the market currently use a new copper-aluminum bonded metal substrate for heat dissipation. With a high thermal conductivity, the copper base can quickly absorb the heat released by the heating device, and the aluminum base can p...

AI Technical Summary

Problems solved by technology

[0004] In the process of processing, when the copper-aluminum composite substrate is deposited with copper before electroplating, the protective film on the aluminum base surface will sink copper, and the copper film will easily fall off, forming copper slag, which will stick to the normal copper foil surface. Only one side of copper foil conducts electricity during electroplating, and it is easy to burn the board, which affects the quality

If the protective film of the aluminum base surface is removed and the copper wire is immersed, the aluminum base surface will have the risk of contaminating the potion, so a new production process needs to be developed

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