Finite Element Simulation Method for Determining the Complete Rule of Solder Joint Damage Accumulation in Irregular Thermal Profile

Abstract

The invention provides a finite element simulation method for determining a complete rule of solder joint damage accumulation under an irregular temperature-following profile. The method comprises thefollowing steps: S1, a finite element simulation pretreatment; S2, finite element simulation of solder joints under different temperature loads, S3, finite element simulation post-processing, S4, determination of the nonlinear damage accumulation expression of solder joints under irregular temperature profile. The nonlinear damage accumulation rule determined by the simulation method is based ona fatigue crack damage model of a solder joint, Compared with the traditional method based on statistics, this method is more practical and takes into account the influence of stacking sequence of different temperature profiles. The result is more accurate, and the error can be controlled within 8%, which greatly reduces the error range.

Description

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AI Technical Summary

Benefits of technology

This patented technology uses simulations that predict how cracks will occur when subjected to heat or mechanical stress during use without requiring expensive equipment such as lasers. It also considers factors like material size and shape affecting this process, resulting in better accuracy compared to previous models. Overall, it provides technical benefits over existing techniques but at lower costs due to its simplicity and ease-of-use features.

Problems solved by technology

This patented technical solution describes how to improve the performance of electronic devices by reducing their risk of experiencing failures due to heat cycles over time caused by repeated use or exposure during normal operation. Current methods involve testing various factors such as mechanical properties (stress) and environmental effects like temperatures outside specific ranges. These tests require extensive experimentation and expensive laboratory facilities, making them difficult to perform frequently enough to identify any issues related to improving durable electronics designs without requiring excessive effort.

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