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Processing method for suspended gold finger, and circuit board

A processing method and gold finger technology, applied in the direction of laminated printed circuit boards, printed circuits, printed circuit manufacturing, etc., can solve the problems of resource waste cost, poor versatility, strong limitations, etc., to save resources and costs, and reduce costs And the waste of resources, the effect of strong versatility

Inactive Publication Date: 2019-02-22
湖北金禄科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a method for processing a suspended golden finger and a circuit board, so as to solve the problems of existing golden finger circuit boards, which have strong limitations, poor versatility, and easily lead to resource waste and cost increase. question

Method used

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  • Processing method for suspended gold finger, and circuit board
  • Processing method for suspended gold finger, and circuit board
  • Processing method for suspended gold finger, and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a suspended golden finger, which may include:

[0028] 110. Provide a gold finger copper clad laminate, the gold finger area at one end of the gold finger copper clad laminate has multiple gold finger patterns and large copper sheets, and the gold finger patterns are divided into exposed areas connected to the large copper sheets and areas away from all In the pressing area of ​​the large copper sheet, the non-gold finger area of ​​the gold finger copper clad laminate has a circuit pattern.

[0029] In the embodiment of the present invention, the gold finger copper clad laminate provided is as follows Figure 2a As shown, the gold finger copper clad laminate 20 includes an insulating medium in the middle and metal layers on both sides, one end of which is designed with a gold finger area, and the metal layer in the gold finger area is processed into a plurality of gold fi...

Embodiment 2

[0052] Please refer to Figure 2d and 2e , an embodiment of the present invention provides a circuit board with suspended golden fingers, the circuit board may include:

[0053] The circuit board body 30 and at least one suspended gold finger 37, one end of the suspended gold finger 37 is embedded in the circuit board body 30, and the other end extends from a side wall of the circuit board body 30, and the gold finger 37 is Gold-plated copper-clad laminate construction.

[0054] The circuit board body may include multiple circuit layers, and each gold finger 37 may be connected to at least one of the multiple circuit layers through a metallized through hole 35 .

[0055] The circuit board provided by the embodiment of the present invention can be manufactured by the method of the first embodiment. For a more detailed description, please refer to Embodiment 1.

[0056] As mentioned above, the embodiment of the present invention provides a circuit board with suspended gold f...

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Abstract

The invention discloses a processing method for a suspended gold finger and a circuit board, which can solve the technical problem that the existing gold finger circuit boards have high limitation, are poor in versatility, and cause resource waste and cost increase. The method includes: pressing a gold finger copper clad plate having a gold finger pattern to an inner layer of a multi-layer board;processing a set of via holes outside a forming area of the multi-layer board, wherein the via holes are connected to the gold finger pattern through a large copper piece on the gold finger copper clad plate; performing deep-cut milling to reveal the gold finger pattern; performing gold plating on the gold finger pattern; performing deep-cut milling to remove the non-gold finger pattern part outside the forming area of the multi-layer board, forming a gold finger, and obtaining a circuit board having a suspended structure gold finger.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing suspended golden fingers and a circuit board. Background technique [0002] At present, the structural design of printed circuit board (PCB) boards with gold fingers generally adopts a method of involving the gold fingers within the forming area of ​​the surface layer of the circuit board. The gold finger that provides the plug-in function should match the size of the plug-in interface. The thickness of the gold-finger circuit board should be consistent with the opening height of the plug-in interface. When the opening height of the plug-in interface is fixed, the circuit where the gold finger is located The plate thickness is thus fixed. [0003] When the thickness of the gold finger circuit board needs to be increased to achieve multi-functional requirements, the supporting plug-in interface equipment needs to be completely changed, which is a wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/00H05K3/40
CPCH05K1/117H05K3/0058H05K3/403
Inventor 李继林叶庆忠麦睿明
Owner 湖北金禄科技有限公司
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