Processing method of suspension-structure gold finger, and circuit board

A suspended structure, gold finger technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, electrical connection printed components, etc., can solve the problems of waste of resources, poor versatility, strong limitations, etc., to save resources and costs, Reduce costs and waste of resources, with strong versatility

Active Publication Date: 2015-10-14
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a processing method and a circuit board of a gold finger with a suspended structure, so as to solve the technical problems of existing gold finger circuit boards, which have strong limitations, poor versatility, and easily lead to resource waste and cost increase.

Method used

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  • Processing method of suspension-structure gold finger, and circuit board
  • Processing method of suspension-structure gold finger, and circuit board
  • Processing method of suspension-structure gold finger, and circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a gold finger with a suspended structure, which may include:

[0028] 110. Provide multiple gold finger copper clad laminates with different thicknesses, the gold finger area at one end of the gold finger copper clad laminate has multiple gold finger patterns and copper sheets connected to the multiple gold finger patterns.

[0029] In the embodiment of the present invention, the gold finger copper clad laminate provided is as follows Figure 2a with 2b As shown, the gold finger copper clad laminate 20 includes an insulating medium 201 in the middle and metal layers on both sides, one end of which is designed with a gold finger area, and the metal layer in the gold finger area is processed into a plurality of gold finger patterns 203 and connected with a plurality of gold finger The copper sheet 204 that is pattern-connected, and the metal layer outside the gold finger a...

Embodiment 2

[0054] Please refer to Figure 2g with 2h , an embodiment of the present invention provides a circuit board with gold fingers in a suspended structure, the circuit board may include:

[0055] The circuit board body 30 and the gold finger 37 of the suspended structure, one end of the gold finger of the suspended structure is embedded in the circuit board body, and the other end extends from one side of the circuit board body, and the gold finger of the suspended structure includes a multi-layer , each layer includes at least one gold finger 37, and the gold finger 37 is a gold-plated copper clad laminate structure.

[0056] The circuit board body may include multiple circuit layers, and each golden finger 37 may be connected to at least one of the multiple circuit layers through a metallized through hole 35 .

[0057] The circuit board provided by the embodiment of the present invention can be manufactured by the method of the first embodiment. For a more detailed descriptio...

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PUM

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Abstract

The invention discloses a processing method of a suspension-structure gold finger, and a circuit board, for solving the technical problems of quite high restrictions, very poor versatility and high proneness to waste of resources and increase of the cost existing in a conventional gold finger circuit board. The method comprises the following steps: providing multiple gold finger copper-clad boards with different thicknesses; pressing a multilayer board, wherein the multiple gold finger copper-clad boards are pressed at different levels of the internal layer of the multilayer board; processing a group of conduction holes outside a formation area of the multilayer board, wherein the conduction holes are connected with copper sheets and gold finger patterns on the gold finger copper-clad boards; removing the portion apart from the formation area of the multilayer board through controlled depth milling yet reserving the gold finger copper-clad boards; gilding the gold finger patterns; and processing the gold finger patterns extending from the gold finger copper-clad boards into gold fingers through controlled depth milling so as to prepare a circuit board with the suspension-structure gold fingers.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing golden fingers with a suspended structure and a circuit board. Background technique [0002] At present, the structural design of printed circuit board (PCB) boards with gold fingers generally adopts the method of involving the gold fingers within the forming area of ​​the surface layer of the circuit board. The gold finger that provides the plug-in function should match the size of the plug-in interface. The thickness of the gold-finger circuit board should be consistent with the opening height of the plug-in interface. When the opening height of the plug-in interface is fixed, the circuit where the gold finger is located The plate thickness is thus fixed. [0003] When the thickness of the gold finger circuit board needs to be increased to achieve multi-functional requirements, the supporting plug-in interface equipment needs to be completely cha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/46H05K1/11
Inventor 刘宝林郭长峰丁大舟缪桦
Owner SHENNAN CIRCUITS
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