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Testing device and method for sub-module of crimping type IGBT (Insulated Gate Bipolar Transistor) module

A technology of sub-modules and modules, applied in the field of electronics, can solve problems such as sub-module testing, and achieve the effects of easy use, high practical value, and simple device structure

Active Publication Date: 2019-02-01
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing test equipment is not designed for sub-module performance testing, so the sub-module cannot be tested directly, so a set of equipment is needed to process the sub-module so that the existing equipment can test the sub-module

Method used

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  • Testing device and method for sub-module of crimping type IGBT (Insulated Gate Bipolar Transistor) module
  • Testing device and method for sub-module of crimping type IGBT (Insulated Gate Bipolar Transistor) module
  • Testing device and method for sub-module of crimping type IGBT (Insulated Gate Bipolar Transistor) module

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Embodiment Construction

[0042] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and examples, so that implementers of the present invention can fully understand how the present invention uses technical means to solve technical problems, and achieve the realization process of technical effects and according to the above-mentioned realization process The present invention is implemented concretely. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0043] In the application scenario of the prior art, there is a crimping type IGBT module. The internal structure of the crimping type IGBT module is that a plurality of sub-module units are connected in parallel, and each sub-module is independently distributed. In this p...

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Abstract

The invention discloses a testing device and a method for a sub-module of a crimping type IGBT module. The device comprises an emitter lead-out end, a gate lead-out end, a collector lead-out end, a pressure block, a test chamber, and a screw. The upper surface of the pressure block is configured with a screw contact portion, and the lower surface of the pressure block is configured with a gate contact portion and a protruding pressure head of the pressure block. The gate contact portion is connected to the gate lead-out end. The pressure head of the pressure block is connected to the emitter lead-out end. The top of the inside of the test chamber is configured with a threaded screw placement opening, and the bottom of the inside of the test chamber corresponding to the screw placement opening is configured with a placement portion for arranging the sub-module to be tested of the IGBT module. The screw has the threads, and is matched with the screw placement opening. The device of the invention is matched with the sub-module of the crimping type IGBT module, can assist existing test equipment to test the sub-module of the crimping type IGBT module. Compared with the equipment in theprior art, the device of the invention has the advantages of simple structure, simple use, and high practical value.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a testing device and method for a crimping type IGBT module sub-module. Background technique [0002] With the continuous expansion of the application range of the insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT), the types of IGBT are also increasing. [0003] In the application scenario of the prior art, there is a crimping type IGBT module. The internal structure of the crimping type IGBT module is that a plurality of sub-module units are connected in parallel, and each sub-module is independently distributed. In this parallel system of multiple sub-modules, the characteristics of the sub-modules will directly affect the characteristics of the entire system, so it is necessary to perform performance tests on all sub-modules. [0004] However, the existing test equipment is not designed for sub-module performance testing, so the sub-module cannot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/067
CPCG01R1/06722G01R31/2608
Inventor 万超群宋自珍李义李炘陈彦李世平常桂钦
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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