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Display backplane, manufacturing method thereof, and display device

A display backplane and thin film packaging technology, applied in the field of display backplanes and display devices, can solve the problems of limiting the popularity of OLED display backplanes, the display backplane needs to be improved, and corrosion damage.

Active Publication Date: 2020-12-08
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because OLED devices will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for OLED devices.
At present, thin-film packaging is a packaging method widely used in the production of OLED display backplanes. This packaging method still has shortcomings that limit the popularity of OLED display backplanes.
[0003] Therefore, the current display backplane still needs to be improved

Method used

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  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary, only for explaining the present invention, and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, the technique or condition described in the literature in the field or the product specification is used. The reagents or instruments used without the manufacturer's indication are conventional products that can be obtained from the market.

[0026] The present invention is accomplished based on the following knowledge and findings of the inventors:

[0027] At present, the way of encapsulating the display backplane is usually to use a thin film encapsulation structure stacked with an inorganic layer and an organic layer to cover the OLED device, so as to achieve the purpose of blocking water and oxygen. Among them, the inorganic layer is used for water and oxygen barrier, and the org...

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Abstract

The invention provides a display backplane, a manufacturing method thereof, and a display device. Wherein, the display backplane includes: a substrate; a thin film transistor array, the thin film transistor array is arranged on one surface of the substrate; an ultraviolet light shielding layer, the ultraviolet light shielding layer is arranged on the thin film transistor array away from the substrate One side of the bottom; a pixel defining layer, the pixel defining layer is arranged on the side of the ultraviolet light shielding layer away from the substrate; a thin film encapsulation layer, the thin film encapsulating layer is arranged on the pixel defining layer away from the One side of the substrate, wherein the pixel defining layer contains a photo-converting material, and the photo-converting material can emit ultraviolet light under excitation of infrared light. The inventors have found that the display backplane has a simple structure and is easy to implement without using an expensive ultraviolet mask, thereby reducing the production cost of the display backplane.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display backplane, a manufacturing method thereof, and a display device. Background technique [0002] In recent years, OLED has gradually developed in the field of display and lighting technology, especially in the field of display, because of its advantages of high response, high contrast, flexibility, etc., it has a wide range of application prospects. However, because the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to choose a better packaging method for the OLED device. At present, thin film encapsulation is an encapsulation method widely used in the production of OLED display backplanes, and there are still deficiencies in this encapsulation method, which limit the popularization of OLED display backplanes. [0003] Therefore, the current display backplane still needs to be improved. SU...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32
CPCH10K59/126H10K59/122H10K59/8731G02B5/208H01L27/1248H10K2102/331G02B5/003H01L27/1218H10K50/84
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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