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Silicon material linear cutting liquid and preparation method thereof

A technology of cutting fluid and silicon material, applied in the direction of lubricating composition, etc., can solve the problems of reducing slicing work efficiency, prone to slippery knife, increasing slicing cost, etc., to improve slicing work efficiency, smooth surface without marks, reduce slicing cost effect

Inactive Publication Date: 2019-01-25
DALIAN SANDAAOKE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the quality problem of the existing cutting fluid, it is easy to have slipping knife during the slicing process, the diamond wire for cutting is broken, the surface of the silicon wafer has obvious line marks after cutting, and the residual cutting fluid is serious and difficult to clean. A large amount of foam will be generated and the tank will be overflowed, which will increase the cost of slicing and reduce the working efficiency of slicing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] The silicon material cutting fluid of the present invention has the following raw materials and mass percentages: 7% of non-ionic twin-type powerful wetting agent, 4% of molecular-grade water-based defoamer, 21% of low-foaming surfactant and the balance of pure water.

[0012] The nonionic gemini-type powerful wetting agent is purchased from Shanghai Sangjing Chemical Industry, and its structural formula is as follows:

[0013] ;

[0014] The molecular grade water-based defoamer is a high-performance molecular grade water-based defoamer, purchased from BASF;

[0015] The low-foaming surfactant is BASF PE6400.

[0016] The preparation method of the above-mentioned silicon material cutting fluid is carried out in accordance with the following steps:

[0017] a. add weighed pure water in the reactor;

[0018] b. Add low-foaming surfactant, non-ionic gemini-type strong wetting agent, and molecular-grade water-based defoamer in sequence;

[0019] c. Start the stirrer, ...

Embodiment 2

[0021] The silicon material cutting fluid of the present invention has the following raw materials and mass percentages: 5% non-ionic gemini-type powerful wetting agent, 5% molecular-grade water-based defoamer, 20% low-foaming surfactant and the balance of pure water.

[0022] The raw materials used and the preparation method are the same as in Example 1.

Embodiment 3

[0024] The silicon material cutting fluid of the present invention has the following raw materials and mass percentages: 8% non-ionic gemini-type powerful wetting agent, 3% molecular-grade water-based defoamer, 22% low-foaming surfactant and the balance of pure water.

[0025] The raw materials used and the preparation method are the same as in Example 1.

[0026] When in use, add water to the silicon material cutting fluid of the present invention to prepare a working fluid with a mass concentration of 0.5-1%, and then put it on a cutting machine to perform the cutting process.

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Abstract

The invention discloses a silicon material cutting liquid capable of ensuring no mark or residue for silicon material cutting and easy to wash. The cutting liquid comprises the following raw materialsby mass: 5-8% of nonionic gemini strong wetting agent, 3-5% of molecular-level aqueous defoaming agent, 20-22% of low foaming surfactant and the balance pure water. The preparation method includes the following steps: adding the weighed pure water to a reaction kettle; sequentially adding the low foaming surfactant, the nonionic gemini strong wetting agent and the molecular-level aqueous defoaming agent; starting an agitator, setting the rotation speed to be 60 rpm and stirring until the solution is a colorless transparent solution.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to a silicon material cutting fluid capable of ensuring that the silicon material is cut without traces, residues, and easy to wash and a preparation method thereof. Background technique [0002] The main products of photovoltaic silicon wafer processing enterprises are silicon ingots, silicon wafers, solar panels and high-efficiency photovoltaic power generation components. During the production process, CNC wire cutting machines are required to slice silicon materials (sapphire, silicon, ceramics, etc.). However, due to the quality problem of the existing cutting fluid, it is easy to have slipping knife during the slicing process, the diamond wire for cutting is broken, the surface of the silicon wafer has obvious line marks after cutting, and the residual cutting fluid is serious and difficult to clean. A large amount of foam will be generated and the tank will be overflowed, which will increas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02
CPCC10M173/02C10M2209/104C10M2209/108
Inventor 李文瀚杨同勇
Owner DALIAN SANDAAOKE CHEM
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